EP3SL200H780I4L vs EP3SL200H780I3N Comparison
Detailed side-by-side comparison of EP3SL200H780I4L by Intel and EP3SL200H780I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL200H780I4L | EP3SL200H780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,395.00 | $7,200.00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | β |
| Embedded Memory (Bits) | 10,901,504 | β |
| Maximum User I/O | 488 | β |
| Core Supply Voltage | 0.86 V to 1.15 V | β |
| Process Technology | 65 nm CMOS | β |
| Internal Performance | 375 MHz | β |
| Package | 780-pin FC-HFBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceivers | Up to 24 channels | β |
| Transceiver Data Rate | Up to 6.375 Gbps | β |
| DSP Blocks | 9x9 / 18x18 / 36x36 multipliers | β |
| Memory Interface Support | DDR3, DDR2, DDR, QDR II+, RLDRAM II | β |
| JTAG Support | IEEE Std 1149.1 Boundary-Scan | β |
| RoHS Status | Compliant | Compliant |
| Speed Grade | I4 (Industrial) | β |
| HardCopy Support | Compatible (Lattice-style migration path via HardCopy III) | β |
| RAM Bits | β | 10,901,504 |
| User I/O | β | 488 |
| Package Pin Count | β | 780 |
| Supply Voltage (Core) | β | 0.9 V |
| Technology | β | CMOS, 40 nm |
| Process Node | β | 40 nm |
| Number of Terminals | β | 780 |
| Case / Package Code | β | BGA-780 |
| Lead-Free | β | Yes |