EP3SL200H780I4L vs EP3SL200H780I4 Comparison

Detailed side-by-side comparison of EP3SL200H780I4L by Intel and EP3SL200H780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780I4L EP3SL200H780I4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $6,255.75
Family Stratix III L Stratix III
Logic Elements 200,000 β€”
Logic Array Blocks (LABs) 8,000 8000
Embedded Memory (Bits) 10,901,504 β€”
Maximum User I/O 488 β€”
Core Supply Voltage 0.86 V to 1.15 V β€”
Process Technology 65 nm CMOS 65 nm CMOS
Internal Performance 375 MHz β€”
Package 780-pin FC-HFBGA (Flip-Chip) β€”
Mounting Type Surface Mount β€”
Operating Temperature -40C to +100C (Industrial) β€”
Transceivers Up to 24 channels β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
DSP Blocks 9x9 / 18x18 / 36x36 multipliers β€”
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II β€”
JTAG Support IEEE Std 1149.1 Boundary-Scan β€”
RoHS Status Compliant Compliant
Speed Grade I4 (Industrial) I4 (industrial)
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) β€”
Series β€” Stratix III L
Logic Elements (LE) β€” 200,000
Embedded Memory Bits β€” 10,901,504
User I/O Count β€” 488
DSP Multipliers (18x18) β€” 384
Voltage - Core Supply β€” 1.1 V
Package Type β€” 780-BBGA / FCBGA (FC-HFBGA)
Package Dimensions β€” 33 mm x 33 mm
Operating Junction Temperature β€” -40C to +100C (industrial)
Configuration Memory β€” SRAM-based, volatile
Design Tool β€” Quartus II (legacy) / Quartus Prime

Datasheets & Resources

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