EP3SL50F780C2 vs EP3SL50F780C3 Comparison

Detailed side-by-side comparison of EP3SL50F780C2 by Intel and EP3SL50F780C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL50F780C2 EP3SL50F780C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $199.95 $540.00
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 β€”
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (bits) 2,184,192 β€”
Maximum User I/Os 488 β€”
Core Voltage 1.1 V β€”
Process Technology 65 nm β€”
Package 780-ball FCBGA (Flip-Chip BGA) β€”
Operating Temperature 0Β°C to +85Β°C (commercial) 0C to +85C (Commercial)
Maximum Core Frequency 600 MHz β€”
Configuration Interface JTAG / passive serial / fast passive parallel β€”
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces β€”
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) β€”
RoHS Status Compliant Compliant
Mounting Type Surface Mount (BGA) β€”
Series β€” Stratix III
Logic Elements β€” 47,500
Embedded Memory Bits β€” 2,184,192
User I/Os β€” 488
Package Type β€” 780-BBGA, FCBGA (FineLine)
Device Pin Count β€” 780
Speed Grade β€” 3
Supply Voltage (Core) β€” [DATA_NEEDED: VCCINT nominal value]
PLLs β€” 12
Global Clock Networks β€” 24
Process Node β€” 65 nm TSMC
Configuration Method β€” SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free β€” Lead-Free (per package marking); Halogen-Free status unknown
Moisture Sensitivity Level (MSL) β€” MSL3 (per JEDEC J-STD-020, typical for large FBGA)

Datasheets & Resources

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