EP3SL50F780C3G vs EP3SL50F780C2 Comparison
Detailed side-by-side comparison of EP3SL50F780C3G by Intel and EP3SL50F780C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G β ActiveSpecification Comparison
| Parameter | EP3SL50F780C3G | EP3SL50F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $625.00 | $199.95 |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | β |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 |
| Distributed RAM | 2.08 Mbit | β |
| User I/O Count | 488 | β |
| Core Voltage | 1.1 V | 1.1 V |
| Operating Temperature | 0C to +85C (commercial) | 0Β°C to +85Β°C (commercial) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | β |
| Package | 780-ball FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | SMD/SMT | Surface Mount (BGA) |
| Packaging | Tray | β |
| Process Technology | TSMC 40 nm low-power | 65 nm |
| Configuration Method | SRAM-based, JTAG/AS configuration | β |
| Design Software | Intel Quartus II (v9.0+) | β |
| RoHS Status | Compliant (per DigiKey listing) | Compliant |
| Logic Array Blocks (LABs) | β | 1,900 |
| Maximum User I/Os | β | 488 |
| Maximum Core Frequency | β | 600 MHz |
| Configuration Interface | β | JTAG / passive serial / fast passive parallel |
| I/O Standards | β | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | β | TriMatrix (MLAB, M9K, M144K blocks) |