EP3SL50F780C3G vs EP3SL50F780C3 Comparison

Detailed side-by-side comparison of EP3SL50F780C3G by Intel and EP3SL50F780C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL50F780C3G EP3SL50F780C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $625.00 $540.00
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 β€”
Adaptive Logic Modules (ALM) 19,000 β€”
Embedded Memory (bits) 2,184,192 β€”
Distributed RAM 2.08 Mbit β€”
User I/O Count 488 β€”
Core Voltage 1.1 V β€”
Operating Temperature 0C to +85C (commercial) 0C to +85C (Commercial)
Temperature Grade Suffix C (commercial, "3" speed grade) β€”
Package 780-ball FBGA β€”
Mounting Type SMD/SMT β€”
Packaging Tray β€”
Process Technology TSMC 40 nm low-power β€”
Configuration Method SRAM-based, JTAG/AS configuration SRAM-based, supports Partial Reconfiguration
Design Software Intel Quartus II (v9.0+) β€”
RoHS Status Compliant (per DigiKey listing) Compliant
Series β€” Stratix III
Logic Elements β€” 47,500
Logic Array Blocks (LABs) β€” 1,900
Embedded Memory Bits β€” 2,184,192
User I/Os β€” 488
Package Type β€” 780-BBGA, FCBGA (FineLine)
Device Pin Count β€” 780
Speed Grade β€” 3
Supply Voltage (Core) β€” [DATA_NEEDED: VCCINT nominal value]
PLLs β€” 12
Global Clock Networks β€” 24
Process Node β€” 65 nm TSMC
Lead-Free / Halogen-Free β€” Lead-Free (per package marking); Halogen-Free status unknown
Moisture Sensitivity Level (MSL) β€” MSL3 (per JEDEC J-STD-020, typical for large FBGA)

Datasheets & Resources

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