EP3SL50F780I3 vs EP3SL70F780I3 Comparison

Detailed side-by-side comparison of EP3SL50F780I3 by Intel and EP3SL70F780I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SL70F780I3 EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SL50F780I3 EP3SL70F780I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $632.63 $1,096.81
Series Stratix III L β€”
Logic Elements 47,500 67,500
Logic Array Blocks (LABs) 1,900 β€”
User I/O Pins 488 β€”
Total Memory Bits 2,106 Kbit (M9K + M144K) β€”
Transceiver Channels 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) β€”
Package 780-ball FC-FBGA (FineLine BGA), 1 mm pitch 780-ball FineLine BGA (FC-FBGA), 28x28 mm
Process Technology 65 nm β€”
Core Voltage Selectable 1.1 V / 0.9 V 1.1 V
Speed Grade I3 (industrial, third-fastest bin) I3 (industrial)
Operating Temperature -40C to +100C (industrial) -40 C to +100 C (Industrial)
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Lead Free Yes β€”
Vertical Migration Drop-in to EP3SL70 in 780-FBGA package β€”
Family β€” Stratix III L
Embedded Memory Bits β€” 2,699,264 bits
Maximum User I/O β€” 488
Process Node β€” 65 nm
Package Code β€” BGA780,28X28,40
Configuration Mode β€” JTAG IEEE 1149.1, Passive Serial, Active Serial
Number of Terminals β€” 780
Supplier Device Package β€” 780-BBGA, FCBGA

Datasheets & Resources

Browse All Products Create BOM Request Quote