EP3SL70F484I3 vs EP3SL50F484I3 Comparison
Detailed side-by-side comparison of EP3SL70F484I3 by Intel and EP3SL50F484I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL70F484I3 | EP3SL50F484I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,013.66 | $701.23 |
| Family | Stratix III L | Stratix III L (Low Power) |
| Logic Elements | 67,500 | β |
| Adaptive Logic Modules (ALMs) | 33,000 | β |
| Logic Array Blocks (LABs) | 2,700 | 1,900 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | β |
| M9K Memory Blocks | 288 | β |
| M144K Memory Blocks | 12 | β |
| DSP Blocks (18x18 multipliers) | 384 | β |
| User I/O Pins | 296 | β |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | Stratix III L β supports high-speed serial transceivers per family datasheet |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | β |
| Process Node | TSMC 40 nm | β |
| Speed Grade | -3 (mid-tier) | β |
| Operating Temperature | -40C to +100C (industrial) | 0 Β°C to +85 Β°C (commercial) |
| Package | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | β |
| Design Software | Quartus II (legacy) | β |
| RoHS Status | Compliant | β |
| Device Logic Elements | β | 47,500 |
| Embedded Memory (bits) | β | 2,184,192 |
| Maximum User I/O | β | 296 |
| Process Technology | β | 65 nm |
| Core Voltage | β | 1.1 V |
| Internal Operating Frequency | β | 500 MHz |
| Mounting Type | β | Surface Mount |
| Lead-Free / RoHS | β | [DATA_NEEDED: lead-free/RoHS status] |
| MSL Level | β | [DATA_NEEDED: MSL level] |
| Configuration Scheme | β | SRAM-based (volatile, requires external config device) |