EP3SL70F484I3 vs EP3SL70F484C2 Comparison
Detailed side-by-side comparison of EP3SL70F484I3 by Intel and EP3SL70F484C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SL70F484I3 | EP3SL70F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,013.66 | $980.00 |
| Family | Stratix III L | Stratix III L FPGA |
| Logic Elements | 67,500 | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,000 | β |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | β |
| M9K Memory Blocks | 288 | β |
| M144K Memory Blocks | 12 | β |
| DSP Blocks (18x18 multipliers) | 384 | β |
| User I/O Pins | 296 | β |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | β |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | β |
| Process Node | TSMC 40 nm | β |
| Speed Grade | -3 (mid-tier) | C2 |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (Commercial) |
| Package | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | β |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | β |
| Design Software | Quartus II (legacy) | β |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Series | β | Stratix III L |
| Embedded Memory | β | 2,699,264 bits |
| User I/O Count | β | 296 |
| Core Voltage | β | 1.1 V |
| Process Technology | β | 65 nm |
| Maximum Core Frequency | β | 600 MHz |
| Package Type | β | 484-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | β | 484 |
| Mounting Type | β | Surface Mount |