EP4CE55F23I8L vs EP4CE55F29I8L Comparison

Detailed side-by-side comparison of EP4CE55F23I8L by Intel and EP4CE55F29I8L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE55F23I8L EP4CE55F29I8L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $143.43 $131.42
Device Family Cyclone IV E β€”
Logic Elements (LEs) 55,856 β€”
Embedded Memory Bits 2,396,160 bits (~234 Kbit / ~292.5 KByte) 2,396,160 bits
Maximum User I/O Pins 324 β€”
Embedded 18x18 Multipliers 156 156
General-Purpose PLLs 4 β€”
Process Technology 60 nm 60 nm low-power
Core Supply Voltage 1.2 V β€”
Package 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) 780-FBGA (FineLine BGA), 29x29 mm
Operating Temperature Range -40C to +100C (Industrial) β€”
Configuration Modes AS, PS, JTAG Passive Serial, Fast Passive Parallel, Active Serial, JTAG
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X β€”
Speed Grade 8 8
RoHS Status Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes β€”
Family β€” Cyclone IV E
Device Logic Elements β€” 55,856
Maximum User I/Os β€” 374
PLLs β€” 4
Global Clock Networks β€” 20
Logic Array Blocks (LABs) β€” 3,435
Core Voltage VCCINT β€” 1.0 V / 1.2 V
Auxiliary Voltage VCCAUX β€” 2.5 V
I/O Voltage VCCIO β€” 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Operating Temperature (Industrial) β€” -40C to +100C junction
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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