EP4CGX50CF23I7NAA vs EP4CGX50CF23C6N Comparison

Detailed side-by-side comparison of EP4CGX50CF23I7NAA by Intel and EP4CGX50CF23C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX50CF23I7NAA EP4CGX50CF23C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $79.50 $65.80
Family Cyclone IV GX β€”
Logic Elements (LEs) 49,888 β€”
Logic Array Blocks (LABs) 3,136 β€”
Embedded Memory (Bits) 2,562,048 β€”
Embedded Memory (M9K Blocks) 270 β€”
Embedded 18x18 Multipliers 132 132
Phase-Locked Loops (PLLs) 4 4
Global Clock Networks 20 11
Maximum User I/O Pins [DATA_NEEDED: exact max user I/O for F484] β€”
Transceivers 8 channels, up to 3.125 Gbps Up to 8 channels at 3.125 Gbps
Core Voltage 1.2 V β€”
Operating Temperature Range -40C to +100C (Industrial, I7) β€”
Speed Grade 7 C6
Package 484-ball FineLine BGA (F23), 1.0mm pitch 484-ball FineLine BGA (FBGA-484)
Mounting Type Surface Mount (BGA) β€”
Configuration Scheme AS, PS, JTAG, FPP β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
MSL Level 3 β€”
Series β€” Cyclone IV GX
Device Family β€” EP4CGX50
Logic Elements (LE) β€” 49,888
Configurable Logic Blocks (CLBs) β€” 3,118
Total Memory Bits β€” 2,562,048 bits
Embedded Memory Blocks (M9K) β€” 56
Maximum User I/O β€” 290
Core Supply Voltage β€” 1.2 V
Process Technology β€” 60 nm low-power CMOS
Package Dimensions β€” 23 x 23 mm, 1.0 mm pitch
Operating Temperature β€” 0C to +85C (Commercial)

Datasheets & Resources

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