EP4CGX50DF23C6N vs EP4CGX50DF23C7N Comparison

Detailed side-by-side comparison of EP4CGX50DF23C6N by Intel and EP4CGX50DF23C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP4CGX50DF23C6N EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel

EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel

EP4CGX50DF23C6N βœ“ Active

Specification Comparison

Parameter EP4CGX50DF23C6N EP4CGX50DF23C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $52.30 $43.20
Family Cyclone IV GX Cyclone IV GX
Logic Elements 49,888 49,888
Configurable Logic Blocks (CLBs) 3,118 3,118
Embedded Memory 2,340 Kbits β€”
Process Technology 60 nm 60 nm
Core Voltage 1.2 V β€”
Number of Pins / Balls 484 β€”
Package Type 484-ball FBGA (PBGA) β€”
JEDEC Package Code S-PBGA-B484 β€”
User I/O 218 β€”
Transceiver Channels Up to 8 β€”
Maximum Transceiver Data Rate 3.125 Gbps β€”
Operating Temperature Grade Commercial β€”
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method JTAG / Passive Serial / Active Serial β€”
Total RAM Bits β€” 2,432 Kbit (β‰ˆ 304 KB)
Embedded 18x18 Multipliers β€” 66
PLLs β€” 2
Global Clock Networks β€” 8 (with up to 16 clock pins per region)
Number of I/O Pins β€” 290
Transceivers β€” Up to 8 channels, 3.125 Gbps
Core Supply Voltage (VCCINT) β€” 1.15 V to 1.25 V (nominal 1.2 V)
Operating Temperature β€” 0 Β°C to 85 Β°C (commercial)
Package β€” 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm)
Configuration Modes β€” Passive Serial (PS), Active Serial (AS), JTAG
Supported Memory Interfaces β€” DDR2 SDRAM, QDRII SRAM, RLDRAM II
RoHS Status β€” Compliant (Pb-free variant)
MSL Level β€” 3 (168 hours)

Datasheets & Resources

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