EP4CGX50DF23C7N vs EP4CGX50DF23C8N Comparison
Detailed side-by-side comparison of EP4CGX50DF23C7N by Intel and EP4CGX50DF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4CGX50DF23C8N - 49,888 Cells Cyclone IV GX FPGA, 484-FBGA | Intel
EP4CGX50DF23C8N β ActiveSpecification Comparison
| Parameter | EP4CGX50DF23C7N | EP4CGX50DF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $43.20 | $56.40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (β 304 KB) | β |
| Embedded 18x18 Multipliers | 66 | β |
| PLLs | 2 | β |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | β |
| Number of I/O Pins | 290 | β |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | β |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial) | β |
| Package | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FBGA (DF23) |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | JTAG, Passive Serial, Active Serial |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | β |
| RoHS Status | Compliant (Pb-free variant) | Compliant |
| MSL Level | 3 (168 hours) | 3 (168 hours) |
| Core Supply Voltage | β | 1.2 V |
| Ball Pitch | β | 1.00 mm |
| Seated Height | β | 2.40 mm |
| Terminal Form | β | Ball |
| Operating Temperature Grade | β | Commercial (0C to +85C) |