EP4CGX50DF23C7N vs EP4CGX50DF23I7N Comparison
Detailed side-by-side comparison of EP4CGX50DF23C7N by Intel and EP4CGX50DF23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX50DF23C7N | EP4CGX50DF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $43.20 | $105.20 |
| Family | Cyclone IV GX | Cyclone IV |
| Logic Elements | 49,888 | β |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (β 304 KB) | β |
| Embedded 18x18 Multipliers | 66 | β |
| PLLs | 2 | β |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | β |
| Number of I/O Pins | 290 | β |
| Transceivers | Up to 8 channels, 3.125 Gbps | β |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | β |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial) | β |
| Package | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FBGA (BGA-484) |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | β |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | β |
| RoHS Status | Compliant (Pb-free variant) | Compliant |
| MSL Level | 3 (168 hours) | β |
| Series | β | Cyclone IV GX |
| Logic Elements (LE) | β | 49,888 |
| Embedded Memory | β | 2,562 Kbit |
| Number of Logic Cells | β | 49,888 |
| Core Voltage (VCCINT) | β | 1.2 V |
| Maximum User I/O Pins | β | 290 |
| Number of Transceivers | β | 8 (3.125 Gbps) |
| Package Body Size | β | 23 x 23 mm |
| Ball Pitch | β | 1.00 mm |
| Operating Temperature (Industrial) | β | -40 C to +100 C |
| Speed Grade | β | I7 |
| Number of PLLs | β | 4 |