EP4CGX50DF27C8N vs EP4CGX50DF27C6N Comparison

Detailed side-by-side comparison of EP4CGX50DF27C8N by Intel and EP4CGX50DF27C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX50DF27C8N EP4CGX50DF27C6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $49.10 $155.00
Manufacturer Intel (formerly Altera) β€”
Series Cyclone IV GX β€”
Family Cyclone IV GX Cyclone IV GX
Device Type FPGA - Field Programmable Gate Array β€”
Logic Elements 49,888 β€”
Embedded Memory 2,562,048 bits (M9K blocks) 2,562,048 bits (~313 Kbyte)
Maximum User I/O 310 β€”
Package Type FBGA-672 (672-ball Fine-pitch BGA) β€”
Pin/Package Pitch [DATA_NEEDED: BGA ball pitch] β€”
Core Voltage 1.2 V 1.2 V
Supply Voltage (datasheet range) 1.2 V core β€”
Speed Grade 8 (faster performance bin) C6 (commercial)
Temperature Grade C (commercial, 0 C to +85 C) β€”
Transceivers Up to 8 channels, up to 3.125 Gbps Up to 8 channels, 3.125 Gbps
Embedded Multipliers 18x18 multipliers β€”
PLLs 4 4
Global Clocks [DATA_NEEDED: global clock count] 20
Operating Temperature 0 C to +85 C (commercial) 0C to +85C (commercial)
Mounting Type Surface Mount Surface Mount
MSL Level [DATA_NEEDED: moisture sensitivity level] β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Logic Elements (LE) β€” 49,888
Logic Array Blocks (LAB) β€” 3,118
Embedded Memory Blocks β€” M9K
Embedded 18x18 Multipliers β€” 140
User I/O Pins β€” 310
Process Technology β€” 60 nm low-power
Package β€” 672-ball FineLine BGA (FBGA)

Datasheets & Resources

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