EP4CGX50DF27C8N vs EP4CGX50DF27C8 Comparison
Detailed side-by-side comparison of EP4CGX50DF27C8N by Intel and EP4CGX50DF27C8 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4CGX50DF27C8N
EP4CGX50DF27C8N - Cyclone IV GX FPGA 50K LE FBGA-672 | Intel
EP4CGX50DF27C8N β ActiveAltera
EP4CGX50DF27C8
EP4CGX50DF27C8 - Cyclone IV GX FPGA 49,888 LE | Altera | 672-FBGA
EP4CGX50DF27C8 β ActiveSpecification Comparison
| Parameter | EP4CGX50DF27C8N | EP4CGX50DF27C8 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $49.10 | $85.50 |
| Manufacturer | Intel (formerly Altera) | β |
| Series | Cyclone IV GX | β |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Logic Elements | 49,888 | β |
| Embedded Memory | 2,562,048 bits (M9K blocks) | 2,562,048 bits (2,502 Kbit) |
| Maximum User I/O | 310 | β |
| Package Type | FBGA-672 (672-ball Fine-pitch BGA) | β |
| Pin/Package Pitch | [DATA_NEEDED: BGA ball pitch] | β |
| Core Voltage | 1.2 V | 1.2 V |
| Supply Voltage (datasheet range) | 1.2 V core | β |
| Speed Grade | 8 (faster performance bin) | 8 |
| Temperature Grade | C (commercial, 0 C to +85 C) | β |
| Transceivers | Up to 8 channels, up to 3.125 Gbps | 8 channels (up to 3.125 Gbps) |
| Embedded Multipliers | 18x18 multipliers | β |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock count] | β |
| Operating Temperature | 0 C to +85 C (commercial) | Commercial (0C to +85C) / [DATA_NEEDED: exact Tj] |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | β |
| RoHS Status | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | β |
| Logic Elements (LE) | β | 49,888 |
| Logic Array Blocks (LABs) | β | 3,118 |
| Embedded 18x18 Multipliers | β | 150 |
| User I/Os | β | 310 |
| Global Clock Networks | β | 16 |
| Process Technology | β | 60 nm low-power CMOS |
| Package | β | 672-ball FBGA (F27, 27x27 mm) |