EPF10K100EBC356-2 vs EPF10K200SBC356-2X Comparison

Detailed side-by-side comparison of EPF10K100EBC356-2 by Intel and EPF10K200SBC356-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-2 EPF10K200SBC356-2X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $59.95 $295.00
Series FLEX-10KE FLEX-10KS
Family Embedded Programmable Logic Device (PLD) FLEX 10K
Typical Gates 100,000 β€”
Maximum System Gates 158,000 β€”
Logic Elements (LEs) 4,992 β€”
Number of LABs/CLBs 624 β€”
Embedded Array Blocks (EABs) 12 β€”
Total RAM Bits 49,152 β€”
User I/O Pins 274 β€”
Supply Voltage (Core) 2.375 V to 2.625 V (2.5 V nominal) β€”
Propagation Delay (tPD) 0.5 ns β€”
Internal Operating Frequency up to 250 MHz β€”
Process Technology CMOS, SRAM-based CMOS 0.22 Β΅m
Package Type 356-LBGA (35 x 35 mm, 1.27 mm pitch) β€”
Operating Temperature 0 C to 70 C (Commercial) 0 Β°C to +70 Β°C (commercial)
Mounting Type Surface Mount Surface Mount
Configuration Method SRAM, JTAG (IEEE 1149.1) SRAM-based, requires external configuration device (EPC2/EPC8)
Speed Grade -2 -2
RoHS Status [DATA_NEEDED: RoHS compliance] β€”
Lead-Free [DATA_NEEDED: lead-free status] β€”
Logic Elements / Cells β€” 9984
Approximate Gate Count β€” 200,000
Logic Array Blocks (LABs) β€” 1248
User I/O Count β€” 274
Package β€” 356-LBGA (35x35 mm, 1.27 mm pitch)
Supply Voltage β€” 2.375 V to 2.625 V (core)
Propagation Delay (typ.) β€” 0.4 ns
Lead Free Status / RoHS β€” RoHS non-compliant (per third-party listing)
In-System Programmability β€” Yes (via JTAG or serial interface)

Datasheets & Resources

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