EPF10K200SBC600-2 vs EPF10K200EBC600-2 Comparison

Detailed side-by-side comparison of EPF10K200SBC600-2 by Altera and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SBC600-2 EPF10K200EBC600-2
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $85.00 $198.00
Manufacturer Altera (now Intel) β€”
Series FLEX-10KS FLEX-10KE
Logic Elements / Cells 9,984 β€”
Logic Array Blocks (LABs) 1,248 1248
Typical Gates 200,000 β€”
User I/Os 470 β€”
Propagation Delay 0.4 ns 0.4 ns
Voltage - Supply (VCCINT) 2.375 V to 2.625 V β€”
Operating Temperature 0 C to 70 C 0Β°C to +70Β°C (Commercial)
Mounting Type Surface Mount Surface Mount
Package / Case 600-BGA (45 x 45 mm, 1.27 mm pitch) β€”
Supplier Device Package 600-BGA β€”
Logic Family CMOS (SRAM-based) CMOS (SRAM-based)
Process Technology 0.22 micrometer 0.30 Β΅m CMOS
Embedded Array Blocks (EABs) Yes (for distributed RAM/ROM) β€”
PLLs 4 β€”
Configuration Interface IEEE 1149.1 JTAG β€”
MultiVolt I/O Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) β€”
Packaging Bulk / Tray β€”
RoHS Status Non-compliant unknown
Typical Gate Count β€” 200,000 gates
Logic Elements (LEs) β€” 9984
Embedded Memory (EAB) β€” 98304 bits (96 Kbits)
Maximum User I/O β€” 470 pins
Supply Voltage β€” 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards β€” LVTTL, LVCMOS, PCI, GTL+
Package Type β€” 600-ball BGA (BGA-600)
Package Dimensions β€” 45 Γ— 45 mm
Ball Pitch β€” 1.27 mm
Package Height β€” 1.1 mm max
Configuration Method β€” JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status β€” Obsolete

Datasheets & Resources

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