EPF10K200SBC600-2 vs EPF10K200SFI672-2N Comparison

Detailed side-by-side comparison of EPF10K200SBC600-2 by Altera and EPF10K200SFI672-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SBC600-2 EPF10K200SFI672-2N
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $85.00 $138.00
Manufacturer Altera (now Intel) β€”
Series FLEX-10KS β€”
Logic Elements / Cells 9,984 β€”
Logic Array Blocks (LABs) 1,248 β€”
Typical Gates 200,000 200,000
User I/Os 470 470
Propagation Delay 0.4 ns β€”
Voltage - Supply (VCCINT) 2.375 V to 2.625 V β€”
Operating Temperature 0 C to 70 C β€”
Mounting Type Surface Mount Surface Mount
Package / Case 600-BGA (45 x 45 mm, 1.27 mm pitch) β€”
Supplier Device Package 600-BGA β€”
Logic Family CMOS (SRAM-based) β€”
Process Technology 0.22 micrometer 0.22 um CMOS
Embedded Array Blocks (EABs) Yes (for distributed RAM/ROM) β€”
PLLs 4 β€”
Configuration Interface IEEE 1149.1 JTAG β€”
MultiVolt I/O Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) β€”
Packaging Bulk / Tray β€”
RoHS Status Non-compliant Lead-free (N suffix)
Family β€” FLEX 10KE
Device Logic Elements β€” 9,984
Maximum System Gates β€” [DATA_NEEDED: maximum system gates]
Embedded Memory (EAB) β€” 12 EABs, 98,304 bits total
Core Supply Voltage β€” 2.5 V
I/O Supply Voltage β€” 3.3 V (5.0 V tolerant)
Operating Temperature Grade β€” Industrial (-40C to +85C)
Speed Grade β€” -2 (mid)
Package β€” 672-ball FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch
JTAG Boundary-Scan β€” IEEE Std. 1149.1 compliant
Configuration Method β€” SRAM-based (requires external boot ROM)

Datasheets & Resources

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