EPF10K250EBC600-3 vs EPF10K250EBI600-3 Comparison

Detailed side-by-side comparison of EPF10K250EBC600-3 by Intel and EPF10K250EBI600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K250EBI600-3 EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel

EPF10K250EBI600-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K250EBC600-3 EPF10K250EBI600-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $205.00 $110.00
Family FLEX 10KE FLEX 10KE
Logic Elements 12,160 LEs 12,160
Typical Gates 250,000 β€”
Maximum User I/O 470 470
Embedded Array Blocks (EABs) 12 (each 2 Kbits) β€”
Total Embedded Memory 24 Kbits (RAM) β€”
PLLs (Phase-Locked Loops) 4 β€”
Dedicated Clock Inputs 6 β€”
Speed Grade -3 -3 (fastest)
Core Supply Voltage 3.3 V β€”
I/O Supply Voltage 3.3 V (5 V tolerant) β€”
Package 600-ball FineLine BGA 600-ball BGA (HBGA)
Configuration Mode Passive Serial / Passive Parallel / JTAG β€”
Boundary Scan IEEE 1149.1 (JTAG) β€”
Operating Temperature [DATA_NEEDED: operating temperature range] Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range]
Process Technology SRAM-based CMOS 0.22 Β΅m CMOS, 4-layer metal
Typical Gate Count β€” 250,000 system gates
Embedded System Blocks (ESBs) β€” 12
Dedicated Inputs β€” 4
PLLs β€” 4
On-chip RAM β€” Up to 40 Kbits
Ball Pitch β€” 1.93 mm
Core Voltage β€” 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT]
Configuration Method β€” SRAM, requires external configuration device (EPC series)
Mounting Type β€” Surface Mount
RoHS Status β€” Not specified (SnPb / tin-lead finish per legacy distributor listing)
Lead-free β€” no (legacy tin-lead per distributor description)

Datasheets & Resources

Browse All Products Create BOM Request Quote