EPF10K250EBI600-3 vs EPF10K250EBC600-1 Comparison
Detailed side-by-side comparison of EPF10K250EBI600-3 by Intel and EPF10K250EBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 β Last Time BuySpecification Comparison
| Parameter | EPF10K250EBI600-3 | EPF10K250EBC600-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $110.00 | $155.00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | 12,160 |
| Typical Gate Count | 250,000 system gates | β |
| Embedded System Blocks (ESBs) | 12 | β |
| Maximum User I/O | 470 | β |
| Dedicated Inputs | 4 | β |
| PLLs | 4 | β |
| On-chip RAM | Up to 40 Kbits | β |
| Package | 600-ball BGA (HBGA) | 600-BGA FineLine BGA |
| Ball Pitch | 1.93 mm | β |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | 5.0 V |
| Operating Temperature | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | 0Β°C to +70Β°C (Commercial) |
| Speed Grade | -3 (fastest) | -1 |
| Process Technology | 0.22 Β΅m CMOS, 4-layer metal | 0.22 Β΅m SRAM |
| Configuration Method | SRAM, requires external configuration device (EPC series) | JTAG / ByteBlaster / EPC-series PROM |
| Mounting Type | Surface Mount | β |
| RoHS Status | Not specified (SnPb / tin-lead finish per legacy distributor listing) | [DATA_NEEDED: RoHS status] |
| Lead-free | no (legacy tin-lead per distributor description) | β |
| Manufacturer | β | Intel / Altera |
| Typical Gates | β | 250,000 |
| Usable Gates | β | 110,000 |
| Embedded Array Blocks (EABs) | β | 6 |
| Maximum RAM Bits | β | 40,960 |
| Number of PLLs | β | 6 |
| Programmable I/O Voltage | β | 3.3 V / 5.0 V (MultiVolt I/O) |