EPF10K250EGC599-1 vs EPF10K200EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K250EGC599-1 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K250EGC599-1 EPF10K200EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $162.00 $880.00
Product Type FPGA (Field-Programmable Gate Array) β€”
Series FLEX 10K β€”
Logic Elements 40,960 β€”
Equivalent Gates 250,000 β€”
Flip-Flops 12,160 β€”
User I/O Pins 470 β€”
Embedded Array Blocks (EAB) 20 (2 Kbit each) β€”
Package 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) β€”
Pin Count 599 599
Operating Temperature 0C to +70C (Commercial) 0C to +70C (Commercial)
Mounting Type Through-Hole (PGA) Through-Hole (Socket or Solder)
Configuration SRAM (volatile), serial/parallel EPROM β€”
Process Node 0.42 Β΅m CMOS β€”
I/O Standard Support 5.0 V PCI, LVTTL, LVCMOS β€”
Programming Interface JTAG (IEEE 1149.1), passive serial JTAG (IEEE 1149.1)
MSL Level [DATA_NEEDED: moisture sensitivity level] β€”
RoHS Status unknown (ceramic HIPGA package historically non-RoHS) [DATA_NEEDED: RoHS status of ceramic CPGA variant]
Family β€” FLEX 10KE
Logic Elements (LEs) β€” 9,984
Typical Gates β€” 200,000
Embedded Array Blocks (EABs) β€” 470
Total RAM Bits β€” 98,304
Core Supply Voltage β€” 2.375 V to 2.625 V
I/O Voltage Tolerance β€” 5.0 V tolerant
Package Type β€” 599-BCPGA (Ceramic Pin Grid Array)
Package Dimensions β€” 62.48 x 62.48 mm
PLLs β€” 4

Datasheets & Resources

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