EPF10K30EFC256-1X vs EPF10K30EFC256-2N Comparison

Detailed side-by-side comparison of EPF10K30EFC256-1X by Intel and EPF10K30EFC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K30EFC256-1X EPF10K30EFC256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $95.60 $48.57
Family FLEX 10KE FLEX 10KE Embedded Programmable Logic Family
Logic Elements 1728 β€”
Typical Gates 30,000 30,000
Logic Array Blocks (LABs) 216 β€”
Embedded Memory (EAB RAM) 24,576 bits (6 EABs of 4 Kbit each) β€”
User I/O 176 β€”
Maximum Internal Frequency 250 MHz β€”
Propagation Delay (tpd) 0.4 ns to 0.6 ns β€”
Process Technology 0.22 Β΅m CMOS 0.22 Β΅m CMOS, SRAM-based
Core Supply Voltage 2.5 V β€”
MultiVolt I/O Support 2.5 V / 3.3 V / 5 V β€”
Package 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA) 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch
Speed Grade -1X (fastest commercial) -2N (mid-grade, 0.6 ns)
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0 Β°C to +70 Β°C (Commercial)
Configuration Method SRAM, JTAG (IEEE 1149.1) β€”
Phase-Locked Loops 4 β€”
Compliance RoHS (check distributor for specific lot), Pb-free option available β€”
Series β€” FLEX 10KE
Logic Elements (LEs) β€” 1,728
Embedded RAM Bits β€” 24,576
Embedded Array Blocks (EABs) β€” 6
User I/Os β€” 246
Logic Cells β€” 1728
Propagation Delay β€” 0.6 ns (per digchip listing; internal frequency 80 MHz)
Number of Logic Elements β€” 24576
Supply Voltage β€” [DATA_NEEDED: core and I/O rail voltages]
Mounting Type β€” Surface Mount
Configuration β€” Passive Serial / Active Serial / JTAG
Lead Free / RoHS β€” Non-RoHS (legacy, SnPb finish per FBGA-256 family)

Datasheets & Resources

Browse All Products Create BOM Request Quote