EPF10K30ETC144-2N vs EPF10K30ETI144-3 Comparison
Detailed side-by-side comparison of EPF10K30ETC144-2N by Altera and EPF10K30ETI144-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Altera
EPF10K30ETC144-2N
EPF10K30ETC144-2N - 30K Gates FLEX 10KE FPGA | Intel / Altera
EPF10K30ETC144-2N ObsoleteAltera
EPF10K30ETI144-3
EPF10K30ETI144-3 - 30K FLEX-10KE FPGA 102 I/O | Intel / Altera
EPF10K30ETI144-3 ObsoleteSpecification Comparison
| Parameter | EPF10K30ETC144-2N | EPF10K30ETI144-3 |
|---|---|---|
| Brand | Altera | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $14.25 | $29.80 |
| Series | FLEX-10KE | FLEX-10KE |
| Logic Elements / Cells | 1,728 | β |
| Total RAM Bits | 24,576 | β |
| Number of Gates | 30,000 (typical) | β |
| Number of I/O | 102 | β |
| Voltage - Supply | 2.375 V to 2.625 V | β |
| Internal Frequency (max) | 200 MHz | β |
| Propagation Delay | 0.6 ns | β |
| Operating Temperature | 0 Β°C to +70 Β°C (commercial) | -40C to +85C (Industrial) |
| Package / Case | 144-LQFP (TQFP-144) | β |
| Supplier Device Package | 144-TQFP (20 x 20 mm, 0.5 mm pitch) | β |
| Mounting Type | Surface Mount | Surface Mount (Gull Wing) |
| Logic Family | CMOS | β |
| Process Technology | 0.22 ΞΌm | β |
| JTAG Interface | IEEE Std 1149.1 compliant | β |
| RoHS Status | Compliant (Pb-free 'N' suffix) | Non-Compliant (Sn/Pb lead finish) |
| Family | β | FLEX-10KE Embedded Programmable Logic Device |
| Logic Elements | β | 1728 |
| Logic Array Blocks (LABs) | β | 216 |
| Embedded RAM | β | 24,576 bits |
| Embedded Array Blocks (EABs) | β | 6 |
| Maximum User I/O | β | 102 |
| Maximum Equivalent Gates | β | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | β | 12.5 ns |
| Supply Voltage (Core) | β | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | β | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Package | β | 144-LQFP (LFQFP) |
| Package Height | β | 1.6 mm |
| Lead Finish | β | Tin/Lead (Sn/Pb) |
| Configuration Method | β | SRAM (volatile) + JTAG IEEE 1149.1 |