EPM2210F324C3N vs EPM2210GF324C4N Comparison
Detailed side-by-side comparison of EPM2210F324C3N by Intel and EPM2210GF324C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM2210F324C3N | EPM2210GF324C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $65.20 | $25.60 |
| Device Family | MAX II | β |
| Logic Elements (LE) | 2,210 | β |
| Equivalent Macrocells | 1,700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/Os | 272 | β |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) | β |
| Global Clock Networks | 4 | β |
| Core Voltage | 1.8 V | β |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Package | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | 324-ball FineLine BGA (GF324) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | β |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) | IEEE 1149.1 JTAG (ISP) |
| Operating Temperature | 0C to +85C (commercial) | β |
| Process Technology | 6-layer-metal CMOS, flash-based | 0.18 Β΅m 6-layer-metal flash |
| RoHS Status | Lead-free (per datasheet) | Compliant |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) | β |
| Family | β | MAX II |
| Device Type | β | CPLD (Complex Programmable Logic Device) |
| Logic Elements | β | 2,210 |
| User I/Os (max) | β | 272 |
| Supply Voltage - Core (VCCINT) | β | 1.8 V |
| Maximum Internal Frequency | β | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | β | 7.0 ns (C4 speed grade) |
| Operating Temperature (commercial) | β | 0 Β°C to +85 Β°C |