EPM2210F324I8N vs EPM2210GF324C5N Comparison

Detailed side-by-side comparison of EPM2210F324I8N by Altera and EPM2210GF324C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM2210F324I8N EPM2210GF324C5N
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $21.80 $17.90
Family MAX II MAX II G
Device Logic Elements 2210 LEs β€”
User I/O Count 272 β€”
Package FBGA-324 (F324) 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch
Operating Temperature Range -40C to +100C (Industrial, I8N) β€”
Supply Voltage (Core) 1.8 V β€”
Standby Current 25 uA typical β€”
Propagation Delay (tPD) [DATA_NEEDED: tPD value ns] β€”
Clock-to-Output Time (tCO) [DATA_NEEDED: tCO value ns] β€”
Configuration Memory On-chip Flash, instant-on β€”
User Flash Memory [DATA_NEEDED: UFM size Kbits] β€”
Process Technology 0.18 micron β€”
Number of LABs [DATA_NEEDED: LAB count] β€”
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL β€”
Programming Interface JTAG (IEEE 1149.1) β€”
Internal Oscillator Yes β€”
RoHS Status [DATA_NEEDED: RoHS status] Compliant
MSL Level [DATA_NEEDED: MSL level] 3
Series β€” MAX II
Logic Elements β€” 2210
Equivalent Macrocells β€” 1700
User Flash Memory (UFM) β€” 8 Kbits
Maximum User I/O β€” 212
Pin-to-Pin Delay (tPD) β€” 11.2 ns
Propagation Delay β€” 11.2 ns (max)
Technology β€” Flash CMOS, 6-layer metal
Core Voltage β€” 3.3 V / 2.5 V (internal)
I/O Standards β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Operating Temperature β€” 0 Β°C to +85 Β°C (commercial)
Mounting Type β€” Surface Mount
Programmability β€” In-system (JTAG / IEEE 1532), non-volatile
Lead Free β€” Yes

Datasheets & Resources

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