EPM2210GF324C4N vs EPM2210F324C3N Comparison

Detailed side-by-side comparison of EPM2210GF324C4N by Intel and EPM2210F324C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPM2210GF324C4N EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N βœ“ Active

Specification Comparison

Parameter EPM2210GF324C4N EPM2210F324C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $25.60 $65.20
Family MAX II β€”
Device Type CPLD (Complex Programmable Logic Device) β€”
Logic Elements 2,210 β€”
Equivalent Macrocells 1,700 1,700
User I/Os (max) 272 β€”
User Flash Memory (UFM) 8 Kbits 8 Kbits
Supply Voltage - Core (VCCINT) 1.8 V β€”
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Maximum Internal Frequency 247.5 MHz β€”
Pin-to-Pin Logic Delay (tPD) 7.0 ns (C4 speed grade) β€”
Process Technology 0.18 Β΅m 6-layer-metal flash 6-layer-metal CMOS, flash-based
Package 324-ball FineLine BGA (GF324) FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch)
Programming Interface IEEE 1149.1 JTAG (ISP) JTAG 1149.1 (in-system programmable, ISP)
Operating Temperature (commercial) 0 Β°C to +85 Β°C β€”
RoHS Status Compliant Lead-free (per datasheet)
Device Family β€” MAX II
Logic Elements (LE) β€” 2,210
Maximum User I/Os β€” 272
Pin-to-Pin Delay (tPD1) β€” 7 ns (commercial speed grade)
Global Clock Networks β€” 4
Core Voltage β€” 1.8 V
Configuration Memory β€” On-chip flash (non-volatile, instant-on)
Operating Temperature β€” 0C to +85C (commercial)
Design Software β€” Quartus II / Quartus Prime (Intel FPGA)

Datasheets & Resources

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