EPM2210GF324C5 vs EPM2210F324C3N Comparison
Detailed side-by-side comparison of EPM2210GF324C5 by Intel and EPM2210F324C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 β Last Time Buy
Specification Comparison
| Parameter | EPM2210GF324C5 | EPM2210F324C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.60 | $65.20 |
| Family | MAX II | β |
| Device Name | EPM2210 | β |
| Logic Elements (LE) | 2,210 | 2,210 |
| Equivalent Macrocells | 1,700 | 1,700 |
| Maximum User I/Os | 272 | 272 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | 7 ns (commercial speed grade) |
| Internal Performance | 304 MHz | β |
| Core Voltage (VCCINT) | 1.8 V | β |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | β |
| Process Technology | 6-layer-metal flash, 0.18 um | 6-layer-metal CMOS, flash-based |
| Operating Junction Temperature | 0C to +85C (commercial) | β |
| Package | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| In-System Programmability | JTAG (IEEE 1149.1) | β |
| Mounting Type | Surface Mount (BGA) | β |
| RoHS Status | Compliant (lead-free) | Lead-free (per datasheet) |
| Device Family | β | MAX II |
| Global Clock Networks | β | 4 |
| Core Voltage | β | 1.8 V |
| MultiVolt I/O Support | β | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Memory | β | On-chip flash (non-volatile, instant-on) |
| Programming Interface | β | JTAG 1149.1 (in-system programmable, ISP) |
| Operating Temperature | β | 0C to +85C (commercial) |
| Design Software | β | Quartus II / Quartus Prime (Intel FPGA) |