EPM2210GF324C5 vs EPM2210GF324C5N Comparison

Detailed side-by-side comparison of EPM2210GF324C5 by Intel and EPM2210GF324C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPM2210GF324C5

EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera

EPM2210GF324C5 ⚠ Last Time Buy
Intel
EPM2210GF324C5N

EPM2210GF324C5N - 2210 LE MAX II CPLD, 212 I/O, BGA-324 | Intel

EPM2210GF324C5N βœ“ Active

Specification Comparison

Parameter EPM2210GF324C5 EPM2210GF324C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Active
Stock Status In Stock In Stock
Unit Price (USD) $13.60 $17.90
Family MAX II MAX II G
Device Name EPM2210 β€”
Logic Elements (LE) 2,210 β€”
Equivalent Macrocells 1,700 1700
Maximum User I/Os 272 β€”
User Flash Memory (UFM) 8 Kbits 8 Kbits
Pin-to-Pin Delay (tPD1) 5 ns (C5 speed grade) β€”
Internal Performance 304 MHz β€”
Core Voltage (VCCINT) 1.8 V β€”
I/O Voltage (VCCIO) - MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V β€”
Process Technology 6-layer-metal flash, 0.18 um β€”
Operating Junction Temperature 0C to +85C (commercial) β€”
Package 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch
In-System Programmability JTAG (IEEE 1149.1) β€”
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant (lead-free) Compliant
Series β€” MAX II
Logic Elements β€” 2210
Maximum User I/O β€” 212
Pin-to-Pin Delay (tPD) β€” 11.2 ns
Propagation Delay β€” 11.2 ns (max)
Technology β€” Flash CMOS, 6-layer metal
Core Voltage β€” 3.3 V / 2.5 V (internal)
I/O Standards β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Operating Temperature β€” 0 Β°C to +85 Β°C (commercial)
Programmability β€” In-system (JTAG / IEEE 1532), non-volatile
Lead Free β€” Yes
MSL Level β€” 3

Datasheets & Resources

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