EPM2210GF324C5N vs EPM2210GF324C5 Comparison
Detailed side-by-side comparison of EPM2210GF324C5N by Intel and EPM2210GF324C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 β Last Time BuySpecification Comparison
| Parameter | EPM2210GF324C5N | EPM2210GF324C5 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.90 | $13.60 |
| Family | MAX II G | MAX II |
| Series | MAX II | β |
| Logic Elements | 2210 | β |
| Equivalent Macrocells | 1700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | β |
| Pin-to-Pin Delay (tPD) | 11.2 ns | β |
| Propagation Delay | 11.2 ns (max) | β |
| Technology | Flash CMOS, 6-layer metal | β |
| Core Voltage | 3.3 V / 2.5 V (internal) | β |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | β |
| Package | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | β |
| Lead Free | Yes | β |
| RoHS Status | Compliant | Compliant (lead-free) |
| MSL Level | 3 | β |
| Device Name | β | EPM2210 |
| Logic Elements (LE) | β | 2,210 |
| Maximum User I/Os | β | 272 |
| Pin-to-Pin Delay (tPD1) | β | 5 ns (C5 speed grade) |
| Internal Performance | β | 304 MHz |
| Core Voltage (VCCINT) | β | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | β | 6-layer-metal flash, 0.18 um |
| Operating Junction Temperature | β | 0C to +85C (commercial) |
| In-System Programmability | β | JTAG (IEEE 1149.1) |