EPM240GT100C3 vs EPM240F100C5N Comparison
Detailed side-by-side comparison of EPM240GT100C3 by Intel and EPM240F100C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM240GT100C3 | EPM240F100C5N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.95 | $5.20 |
| Family | MAX II | β |
| Logic Elements (LE) | 240 | β |
| Equivalent Macro Cells | 192 | β |
| Pin-to-Pin Delay (tPD) | 4.7 ns | β |
| Maximum Internal Frequency (fMAX) | 304 MHz | β |
| User I/O Count | 80 | β |
| User Flash Memory (UFM) | 8 Kbit | β |
| Process Technology | 0.18 Β΅m 6-layer-metal flash | β |
| Core Supply Voltage | 1.8 V (internal) | β |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | β |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG / ByteBlasterMV |
| Package | TQFP-100 (100-TQFP, 16 Γ 16 mm, 0.5 mm pitch) | 100-ball FineLine BGA (FBGA-100) |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial, C3 suffix) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) | β |
| Device Family | β | MAX II |
| Logic Elements (LEs) | β | 240 |
| Macrocells | β | 192 |
| User I/O Pins (maximum) | β | 80 |
| Pin-to-Pin Logic Delay (tPD) | β | 4.7 ns |
| Maximum Operating Frequency | β | [DATA_NEEDED: fmax per datasheet] |
| Global Clock Networks | β | [DATA_NEEDED: count] |
| Operating Temperature Range | β | 0C to +85C (commercial) |
| Supply Voltage Core (VCCINT) | β | 3.3 V |
| I/O Bank Voltage (VCCIO) | β | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) |
| Configuration Memory | β | Non-volatile flash (instant-on) |
| JTAG Support | β | IEEE 1149.1 boundary-scan |
| RoHS Status | β | Compliant |