EPM570F256C3 vs EPM570F256C3N Comparison
Detailed side-by-side comparison of EPM570F256C3 by Intel and EPM570F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPM570F256C3N
EPM570F256C3N - MAX II CPLD, 570 LEs, 256-FBGA | Intel / Altera
EPM570F256C3N β ActiveSpecification Comparison
| Parameter | EPM570F256C3 | EPM570F256C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $14.85 | $13.75 |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | β |
| Logic Elements / Macro Cells | 440 Logic Elements (~570 macro cells equivalent) | β |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | β |
| User I/O Count | 80 (max for F256 package) | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory | 8 Kbits | β |
| Supply Voltage - Core | 2.5 V / 3.3 V (MultiVolt core) | β |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | β |
| Process Technology | 0.18 Β΅m | 0.18 um, 6-layer-metal flash CMOS |
| Package | 256-FBGA (FineLine BGA) 17 Γ 17 mm | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) - ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | Non-volatile on-chip flash | β |
| Operating Temperature | Commercial: 0 Β°C to +85 Β°C (C3 grade) | β |
| RoHS Status | Compliant | Compliant (per DigiKey listing) |
| Lead-Free | Yes | Yes (per suffix 'N' convention) |
| Design Software | Quartus II / Quartus Prime (legacy support) | β |
| Logic Elements (LEs) | β | 570 |
| Equivalent Macrocells | β | 440 |
| User Flash Memory (UFM) | β | 8 Kbits |
| Core Voltage | β | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | β | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | β | 0 C to +85 C (commercial) |
| MSL Level | β | [DATA_NEEDED: MSL level not stated in provided data] |
| Typical Macroscopic Functions | β | Glue logic, bus bridging, I/O expansion, power sequencing |