EPM570F256C3 vs EPM570F256C4 Comparison

Detailed side-by-side comparison of EPM570F256C3 by Intel and EPM570F256C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPM570F256C4 EPM570F256C4 - 570 LEs MAX II CPLD, 256-FBGA | Intel

EPM570F256C4 - 570 LEs MAX II CPLD, 256-FBGA | Intel

EPM570F256C4 βœ“ Active

Specification Comparison

Parameter EPM570F256C3 EPM570F256C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $14.85 $19.95
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) β€”
Logic Elements / Macro Cells 440 Logic Elements (~570 macro cells equivalent) β€”
Maximum Operating Frequency 304 MHz β€”
Propagation Delay (tPD) [DATA_NEEDED: tPD in ns] β€”
User I/O Count 80 (max for F256 package) β€”
User Flash Memory 8 Kbits 8 Kbits
Supply Voltage - Core 2.5 V / 3.3 V (MultiVolt core) β€”
Supply Voltage - I/O 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) β€”
Process Technology 0.18 Β΅m β€”
Package 256-FBGA (FineLine BGA) 17 Γ— 17 mm 256-ball FineLine BGA (F256)
Mounting Type Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1) - ISP JTAG (IEEE 1149.1), in-system programmable
Configuration Memory Non-volatile on-chip flash Internal Flash (non-volatile, instant-on)
Operating Temperature Commercial: 0 Β°C to +85 Β°C (C3 grade) 0C to +85C (commercial)
RoHS Status Compliant β€”
Lead-Free Yes β€”
Design Software Quartus II / Quartus Prime (legacy support) β€”
Device Name β€” EPM570
Logic Elements (LEs) β€” 570
Maximum User I/O Pins β€” 212
Pin-to-Pin Logic Delay (tPD) β€” 4.5 ns (commercial -4 speed grade)
Supply Voltage - Core (VCCINT) β€” 1.8 V
Supply Voltage - I/O (VCCIO) β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V
MSL Level β€” 3 (168 hours)
Lead-Free / RoHS β€” Yes (lead-free finish, RoHS compliant per product page)
Global Clock Networks β€” 4

Datasheets & Resources

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