EPM570F256C3N vs EPM570F256C3 Comparison

Detailed side-by-side comparison of EPM570F256C3N by Intel and EPM570F256C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570F256C3N EPM570F256C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $13.75 $14.85
Family MAX II MAX II
Logic Elements (LEs) 570 β€”
Equivalent Macrocells 440 β€”
User Flash Memory (UFM) 8 Kbits β€”
Maximum Operating Frequency 304 MHz 304 MHz
Process Technology 0.18 um, 6-layer-metal flash CMOS 0.18 Β΅m
Core Voltage 2.5 V / 3.3 V β€”
I/O Voltage Support (MultiVolt) 1.5 V, 1.8 V, 2.5 V, 3.3 V β€”
Package 256-ball FBGA (FineLine BGA) 256-FBGA (FineLine BGA) 17 Γ— 17 mm
User I/O Count [DATA_NEEDED: confirm exact user-IO count for F256 package] 80 (max for F256 package)
Operating Temperature (C3 grade) 0 C to +85 C (commercial) β€”
Programming Interface JTAG (IEEE 1532 / IEEE 1149.1) + ISP JTAG (IEEE 1149.1) - ISP
Mounting Type Surface Mount Surface Mount
MSL Level [DATA_NEEDED: MSL level not stated in provided data] β€”
RoHS Status Compliant (per DigiKey listing) Compliant
Lead-Free Yes (per suffix 'N' convention) Yes
Typical Macroscopic Functions Glue logic, bus bridging, I/O expansion, power sequencing β€”
Device Type β€” CPLD (Complex Programmable Logic Device)
Logic Elements / Macro Cells β€” 440 Logic Elements (~570 macro cells equivalent)
Propagation Delay (tPD) β€” [DATA_NEEDED: tPD in ns]
User Flash Memory β€” 8 Kbits
Supply Voltage - Core β€” 2.5 V / 3.3 V (MultiVolt core)
Supply Voltage - I/O β€” 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O)
Configuration Memory β€” Non-volatile on-chip flash
Operating Temperature β€” Commercial: 0 Β°C to +85 Β°C (C3 grade)
Design Software β€” Quartus II / Quartus Prime (legacy support)

Datasheets & Resources

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