EPM570F256C3N vs EPM570ZF256C7N Comparison
Detailed side-by-side comparison of EPM570F256C3N by Intel and EPM570ZF256C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM570F256C3N | EPM570ZF256C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.75 | $17.85 |
| Family | MAX II | β |
| Logic Elements (LEs) | 570 | β |
| Equivalent Macrocells | 440 | β |
| User Flash Memory (UFM) | 8 Kbits | β |
| Maximum Operating Frequency | 304 MHz | 201 MHz (internal) |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 Β΅m flash-based CMOS |
| Core Voltage | 2.5 V / 3.3 V | β |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | β |
| Package | 256-ball FBGA (FineLine BGA) | β |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | β |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | β |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1) |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL level not stated in provided data] | β |
| RoHS Status | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | β |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | β |
| Series | β | MAX II |
| Programmable Type | β | In System Programmable |
| Macro Cells | β | 440 |
| Logic Elements (LE) | β | 440 |
| Embedded Flash Memory | β | 8 Kbit |
| Pin-to-Pin Logic Delay (tPD) | β | 9 ns |
| Maximum User I/O Pins | β | 160 |
| Supply Voltage - Internal (VCCINT) | β | 1.71 V to 1.89 V |
| I/O Bank Voltages | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Supplier Device Package | β | 256-MBGA (11x11 mm) |
| Package Type Code | β | 256-FBGA / 256-TFBGA |
| Ball Pitch | β | 1.0 mm |
| Operating Temperature Range | β | 0 Β°C to +85 Β°C (commercial, suffix 'C') |
| Lead-Free Status | β | Lead free |