EPM570F256C5 vs EPM570F256C3N Comparison

Detailed side-by-side comparison of EPM570F256C5 by Intel and EPM570F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570F256C5 EPM570F256C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $7.10 $13.75
Series MAX II β€”
Logic Elements 570 β€”
Macro Cells 440 β€”
User I/O 160 β€”
User Flash Memory 8 Kbit β€”
Process Technology 0.18 Β΅m 0.18 um, 6-layer-metal flash CMOS
Supply Voltage - Internal 2.5 V / 3.3 V β€”
Maximum Operating Frequency 201.1 MHz 304 MHz
Propagation Delay (tPD max) 5.4 ns β€”
Programmable Type In System Programmable (Flash) β€”
JTAG Support IEEE 1149.1 β€”
Package 256-ball FBGA 256-ball FBGA (FineLine BGA)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 Β°C to +85 Β°C (Commercial) β€”
Speed Grade C5 (5 ns) β€”
Family β€” MAX II
Logic Elements (LEs) β€” 570
Equivalent Macrocells β€” 440
User Flash Memory (UFM) β€” 8 Kbits
Core Voltage β€” 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) β€” 1.5 V, 1.8 V, 2.5 V, 3.3 V
User I/O Count β€” [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) β€” 0 C to +85 C (commercial)
Programming Interface β€” JTAG (IEEE 1532 / IEEE 1149.1) + ISP
MSL Level β€” [DATA_NEEDED: MSL level not stated in provided data]
RoHS Status β€” Compliant (per DigiKey listing)
Lead-Free β€” Yes (per suffix 'N' convention)
Typical Macroscopic Functions β€” Glue logic, bus bridging, I/O expansion, power sequencing

Datasheets & Resources

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