EPM570F256C5N vs EPM570F256C3N Comparison
Detailed side-by-side comparison of EPM570F256C5N by Altera and EPM570F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPM570F256C3N
EPM570F256C3N - MAX II CPLD, 570 LEs, 256-FBGA | Intel / Altera
EPM570F256C3N β ActiveSpecification Comparison
| Parameter | EPM570F256C5N | EPM570F256C3N |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.03 | $13.75 |
| Family | MAX II | MAX II |
| Logic Elements | 570 | β |
| Number of Macrocells | 440 | β |
| Internal Supply Voltage | 2.5 V / 3.3 V | β |
| User I/O Count | 160 | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Pin-to-Pin Delay (tPD) | 5.4 ns | β |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Process Technology | 0.18 um | 0.18 um, 6-layer-metal flash CMOS |
| User Flash Memory | 8 Kbits | β |
| Program Memory Type | Non-volatile Flash | β |
| MultiVolt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V | β |
| Programming Interface | JTAG (IEEE 1149.1), in-system | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Package | 256-FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0C to 85C (TJ) | β |
| Logic Elements (LEs) | β | 570 |
| Equivalent Macrocells | β | 440 |
| User Flash Memory (UFM) | β | 8 Kbits |
| Core Voltage | β | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | β | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | β | 0 C to +85 C (commercial) |
| MSL Level | β | [DATA_NEEDED: MSL level not stated in provided data] |
| RoHS Status | β | Compliant (per DigiKey listing) |
| Lead-Free | β | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | β | Glue logic, bus bridging, I/O expansion, power sequencing |