EPM570F256I5 vs EPM570F256C3N Comparison
Detailed side-by-side comparison of EPM570F256I5 by Intel and EPM570F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPM570F256C3N
EPM570F256C3N - MAX II CPLD, 570 LEs, 256-FBGA | Intel / Altera
EPM570F256C3N β ActiveSpecification Comparison
| Parameter | EPM570F256I5 | EPM570F256C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $12.60 | $13.75 |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | β |
| Maximum User I/O Pins | 160 | β |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Number of LABs/CLBs | [DATA_NEEDED: number of LABs] | β |
| Package Type | 256-ball FineLine BGA (FBGA-256) | β |
| Operating Temperature | -40C to +85C (industrial) | β |
| Supply Voltage - Core | 3.3 V (also operates at 3.3V per part description) | β |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, PCI | β |
| MultiVolt I/O | 1.5V / 1.8V / 2.5V / 3.3V | β |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| In-System Programmability | Yes | β |
| Non-volatile Configuration | Yes (on-chip flash) | β |
| Pin-to-Pin Logic Delay (typ) | 5 ns to 7 ns | β |
| Maximum Internal Frequency | [DATA_NEEDED: fMAX MHz per speed grade] | β |
| Number of PLLs | [DATA_NEEDED: number of PLLs] | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (per DigiKey listing) |
| Width | 17 mm (per Partstack) | β |
| Speed Grade | I5 | β |
| Logic Elements (LEs) | β | 570 |
| Equivalent Macrocells | β | 440 |
| Maximum Operating Frequency | β | 304 MHz |
| Process Technology | β | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | β | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | β | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Package | β | 256-ball FBGA (FineLine BGA) |
| User I/O Count | β | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | β | 0 C to +85 C (commercial) |
| MSL Level | β | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | β | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | β | Glue logic, bus bridging, I/O expansion, power sequencing |