EPM570F256I5 vs EPM570F256C4N Comparison

Detailed side-by-side comparison of EPM570F256I5 by Intel and EPM570F256C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570F256I5 EPM570F256C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $12.60 $26.85
Family MAX II β€”
Logic Elements (LE) 570 β€”
Maximum User I/O Pins 160 β€”
User Flash Memory (UFM) 8 Kbits 8 Kbit
Number of LABs/CLBs [DATA_NEEDED: number of LABs] β€”
Package Type 256-ball FineLine BGA (FBGA-256) β€”
Operating Temperature -40C to +85C (industrial) β€”
Supply Voltage - Core 3.3 V (also operates at 3.3V per part description) β€”
I/O Standards Supported LVTTL, LVCMOS, SSTL, PCI β€”
MultiVolt I/O 1.5V / 1.8V / 2.5V / 3.3V β€”
Programming Interface JTAG (IEEE 1149.1) / ISP β€”
In-System Programmability Yes β€”
Non-volatile Configuration Yes (on-chip flash) β€”
Pin-to-Pin Logic Delay (typ) 5 ns to 7 ns β€”
Maximum Internal Frequency [DATA_NEEDED: fMAX MHz per speed grade] 304 MHz
Number of PLLs [DATA_NEEDED: number of PLLs] β€”
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Width 17 mm (per Partstack) β€”
Speed Grade I5 β€”
Series β€” MAX II
Logic Elements β€” 570 LE
Macrocells β€” 440
Logic Array Blocks (LABs) β€” 57
User I/O Count β€” 160
Package β€” 256-ball FineLine BGA (FBGA)
Package Size β€” 17 mm Γ— 17 mm
Process Technology β€” 0.18 Β΅m 6-layer-metal flash
Pin-to-Pin Logic Delay β€” 5.4 ns
Operating Supply Voltage (VCCINT) β€” 2.5 V, 3.3 V
MultiVolt I/O Voltages β€” 1.5 V, 1.8 V, 2.5 V, 3.3 V
Operating Temperature Range β€” 0 Β°C to +70 Β°C (commercial)
In-System Programmability (ISP) β€” Yes (JTAG)

Datasheets & Resources

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