EPM570GF256C3 vs EPM570GF256C4N Comparison
Detailed side-by-side comparison of EPM570GF256C3 by Altera and EPM570GF256C4N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N β ActiveSpecification Comparison
| Parameter | EPM570GF256C3 | EPM570GF256C4N |
|---|---|---|
| Brand | Altera | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10.40 | $9.45 |
| Family | MAX II | MAX II G |
| Device Model | EPM570 | β |
| Logic Elements (LE) | 570 | β |
| Equivalent Macrocells | 440 | β |
| User I/Os (max, FBGA-256) | 212 | β |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | β |
| Internal Performance fMAX | 300 MHz | β |
| Process Technology | 0.18 um 6-layer-metal flash | β |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | β |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | β |
| Package | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FineLine BGA (FBGA-256) |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | β |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | JTAG (IEEE 1149.1), in-system programmable |
| RoHS Status | Compliant (lead-free) | β |
| MSL Level | 3 (per JEDEC J-STD-020, typical for FBGA) | β |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | β |
| Device Series | β | EPM570G |
| Logic Elements (LEs) | β | 570 |
| Macrocells | β | 440 |
| User I/Os | β | 212 |
| Speed Grade | β | C4 (tPD = 4 ns) |
| Pin-to-Pin Delay (tPD) | β | 4 ns |
| Internal fMAX | β | 304 MHz |
| Ball Pitch | β | 1.0 mm |
| Package Dimensions | β | 17 x 17 mm |
| Core Voltage | β | 1.8 V |
| I/O Bank Voltages (MultiVolt) | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | β | -40 Β°C to +125 Β°C (industrial) |
| Configuration Memory | β | Flash (non-volatile, instant-on) |
| Lead-Free / RoHS | β | Lead-free, FBGA package |
| Mounting Type | β | Surface Mount (BGA) |