EPM570M100C4N vs EPM570M100I5N Comparison

Detailed side-by-side comparison of EPM570M100C4N by Intel and EPM570M100I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570M100C4N EPM570M100I5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $14.95 $8.75
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) CPLD (Complex Programmable Logic Device)
Macrocells 440 β€”
Logic Elements (LEs) 570 β€”
User I/Os 76 76
Pin-to-Pin Logic Delay (tPD) 5.4 ns β€”
User Flash Memory (UFM) 8 Kbits β€”
Process Technology 0.18 Β΅m 6-layer-metal flash 0.18 Β΅m CMOS
Package 100-pin MBGA (Micro FineLine BGA) β€”
Operating Temperature 0 Β°C to +85 Β°C (commercial, C suffix) -40Β°C to +100Β°C (I5 grade)
Supply Voltage (Core) 3.3 V (typical for MAX II) β€”
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V β€”
Programming Interface JTAG (IEEE 1149.1) ISP β€”
Configuration Memory Non-volatile flash (instant-on) β€”
RoHS Status Compliant β€”
Number of Macrocells β€” 440
Number of Logic Array Blocks β€” 4 LABs (110 macrocells each)
Maximum Operating Frequency β€” 201.1 MHz
Pin-to-Pin Logic Delay β€” 5.4 ns
User Flash Memory β€” 8 Kbits
Supply Voltage - Core (VCCINT) β€” 2.5 V / 3.3 V
Supply Voltage - I/O (VCCIO) β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked)
Package Type β€” 100-MBGA (Micro FBGA)
Package Size β€” 6 x 6 mm, 0.5 mm pitch
Mounting Type β€” Surface Mount
Lead-Free / RoHS β€” Lead Free, RoHS Compliant
Programmability β€” In-System via JTAG (IEEE 1149.1), non-volatile
Design Software β€” Altera Quartus II / Quartus Prime

Datasheets & Resources

Browse All Products Create BOM Request Quote