EPM570ZF256C7N vs EPM570F256C3N Comparison

Detailed side-by-side comparison of EPM570ZF256C7N by Intel and EPM570F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570ZF256C7N EPM570F256C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $17.85 $13.75
Series MAX II β€”
Programmable Type In System Programmable β€”
Macro Cells 440 β€”
Logic Elements (LE) 440 β€”
Embedded Flash Memory 8 Kbit β€”
Pin-to-Pin Logic Delay (tPD) 9 ns β€”
Maximum Operating Frequency 201 MHz (internal) 304 MHz
Maximum User I/O Pins 160 β€”
Supply Voltage - Internal (VCCINT) 1.71 V to 1.89 V β€”
I/O Bank Voltages 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) β€”
Supplier Device Package 256-MBGA (11x11 mm) β€”
Package Type Code 256-FBGA / 256-TFBGA β€”
Ball Pitch 1.0 mm β€”
Process Technology 0.18 Β΅m flash-based CMOS 0.18 um, 6-layer-metal flash CMOS
Programming Interface JTAG (IEEE 1149.1) JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Operating Temperature Range 0 Β°C to +85 Β°C (commercial, suffix 'C') β€”
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant (per DigiKey listing)
Lead-Free Status Lead free β€”
Family β€” MAX II
Logic Elements (LEs) β€” 570
Equivalent Macrocells β€” 440
User Flash Memory (UFM) β€” 8 Kbits
Core Voltage β€” 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) β€” 1.5 V, 1.8 V, 2.5 V, 3.3 V
Package β€” 256-ball FBGA (FineLine BGA)
User I/O Count β€” [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) β€” 0 C to +85 C (commercial)
MSL Level β€” [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free β€” Yes (per suffix 'N' convention)
Typical Macroscopic Functions β€” Glue logic, bus bridging, I/O expansion, power sequencing

Datasheets & Resources

Browse All Products Create BOM Request Quote