IGLT65R035D2ATMA1 vs IMLT65R040M2HXTMA1 Comparison

Detailed side-by-side comparison of IGLT65R035D2ATMA1 by Infineon and IMLT65R040M2HXTMA1 by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter IGLT65R035D2ATMA1 IMLT65R040M2HXTMA1
Brand Infineon Infineon
Category MOSFETs MOSFETs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $5.10 $4.25
Manufacturer Infineon Technologies Infineon Technologies
Product Family CoolGaN™ G5 TOLT CoolSiC™ G2 (2nd generation SiC trench)
Transistor Type N-Channel enhancement-mode GaN HEMT
Drain-Source Voltage (Vdss) 650 V
Continuous Drain Current (Id) at Tc 47 A
Maximum Power Dissipation (Pd) at Tc 154 W
On-Resistance (Rds(on)) [DATA_NEEDED: typical Rds(on) in mohm]
Gate Threshold Voltage (Vgs(th)) [DATA_NEEDED: typical Vgs(th)]
Input Capacitance (Ciss) at Vds=400V 540 pF
Operating Temperature Range [DATA_NEEDED: Tj min/max]
Package PG-HDSOP-16-8 (top-side cooled) PG-HDSOP-16-6 (surface mount, top-side-cooled)
Mounting Type Surface Mount Surface Mount
Cooling Configuration Top-side cooled (TOLT)
MSL Level [DATA_NEEDED: MSL rating]
RoHS Status Compliant
Lead-Free Yes
Production Wafer Size 200 mm (8 inch)
Technology Silicon Carbide (SiC) N-channel MOSFET
Drain-Source Voltage (VDS) 650 V
Continuous Drain Current (ID, TC) 57 A
Pulsed Drain Current (ID,pulse) 143 A
On-State Resistance RDS(on) (typ, VGS=18V) 40 mΩ
On-State Resistance RDS(on) (max, VGS=18V) 49 mΩ
Total Gate Charge QG 28 nC
Output Charge QOSS @ 400 V 53 nC
Output Energy EOSS @ 400 V 7.2 µJ
Continuous Drain Power Dissipation (PD, TC) 268 W
Recommended Gate Drive Voltage VGS 18 V (turn-off: 0 V or negative)
Operating Junction Temperature -55 °C to +150 °C
Qualification JEDEC industrial
Packaging Tape & Reel
Special Features Kelvin source pin, low reverse-recovery charge, hard-switching optimized

Datasheets & Resources

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