EP1K50FC256-1N vs EP1K50FC256-2N Comparison
Detailed side-by-side comparison of EP1K50FC256-1N by Intel and EP1K50FC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K50FC256-1N | EP1K50FC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $15.10 | $17.95 |
| Family | ACEX-1K | ACEX-1K |
| Series | ACEX-1K (2.5 V) | β |
| Maximum Logic Elements | 2,880 | β |
| Logic Array Blocks (LABs) | 360 | 360 |
| Typical Gates | 50,000 | 50,000 |
| Maximum System Gates | 199,000 | β |
| Embedded Memory (EAB) Bits | 40,960 bits | β |
| User I/O Pins | 186 | β |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | β |
| Maximum Internal Frequency | 250 MHz | β |
| Process Technology | 0.22 um CMOS | 0.22 Β΅m CMOS SRAM |
| Typical Operating Current | 5 mA | β |
| Speed Grade | -1 (commercial) | -2 |
| Operating Temperature | 0 C to 70 C (commercial) | 0 Β°C to 70 Β°C (Commercial) |
| Package | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Lead Status | Lead-free (-N suffix) | β |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | β |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) | JTAG / Passive Serial |
| Logic Elements (LEs) | β | 2,880 |
| Embedded Memory (bits) | β | 40,960 |
| Embedded Array Blocks (EABs) | β | 10 |
| Maximum User I/O Pins | β | 186 |
| Core Voltage (VCCINT) | β | 2.5 V (2.375 V to 2.625 V) |
| Package Dimensions | β | 16 x 16 mm |