EP20K100EFC144-1 vs EP20K100ETC144-1X Comparison
Detailed side-by-side comparison of EP20K100EFC144-1 by Intel and EP20K100ETC144-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K100EFC144-1 | EP20K100ETC144-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $61.75 | $23.10 |
| Device Family | APEX 20KE | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA (Field Programmable Gate Array) |
| Typical Gates | 100,000 | 53248 |
| Maximum System Gates | 263,000 | β |
| Logic Elements | 4,160 | 4160 cells |
| Embedded System Blocks (ESBs) | Yes (memory + dedicated logic) | β |
| User I/Os | 93 | 92 |
| Propagation Delay | 1.6 ns | 1.6 ns |
| PLLs | 4 | β |
| Package Type | 144-ball FBGA (13x13 mm, 1.0 mm pitch) | TQFP-144 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | β |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) | β |
| Operating Temperature | 0 Β°C to 85 Β°C (commercial) | 0 Β°C to 85 Β°C |
| Process Technology | 0.15-Β΅m all-layer copper | 0.22 Β΅m CMOS all-layer copper |
| Configuration Method | SRAM (volatile) - external boot PROM required | β |
| Boundary-Scan Support | IEEE 1149.1 (JTAG) | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Mounting Type | Surface Mount | Surface Mount (gull-wing) |
| Macrocells | β | 416 |
| Core Voltage | β | 1.8 V |
| Maximum Frequency | β | 250 MHz |
| Speed Grade | β | -1 (slowest bin, "-1X") |