Intel

EP20K100EFC144-1 - APEX 20KE FPGA, 100K Gates, 144-FBGA | Intel

MPN: EP20K100EFC144-1 ✗ End of Life
In Stock Ships in 1-3 business days
1.71 V to 1.89 V Vdss 144-ball FBGA (13x13 mm, 1.0 mm pitch) Package
From $61.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $95 $95.00
10 $85.5 $855.00
100 $76 $7,600.00
500 $68.4 $34,200.00
1,000 $61.75 $61,750.00
ℹ️ All prices are in USD

EP20K100EFC144-1 Overview

The Intel EP20K100EFC144-1 is a member of the APEX 20KE family of programmable logic devices (PLDs), delivering up to 100,000 typical gates (263,000 maximum system gates) in a 144-ball FineLine BGA package with 93 user I/Os. Manufactured on a 0.15-µm all-layer copper process, it provides approximately 4,160 logic elements (LEs) and embedded system blocks (ESBs) for on-chip memory and dedicated logic, alongside four phase-locked loops for clock management.

A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. Unlike a CPLD, an FPGA stores its configuration in SRAM cells and is therefore volatile, requiring a configuration ROM or flash on every power-up. The APEX 20KE family extends the original APEX 20K architecture by adding higher-density ESBs, lower core voltage (1.8V), and faster I/O elements, making it a multi-MHz to multi-hundred-MHz class programmable fabric. In the system hierarchy, the EP20K100EFC144-1 sits below modern Cyclone or Stratix FPGAs but above fixed-function ASICs in terms of integration flexibility.

Key features of the EP20K100EFC144-1 include 1.6 ns propagation delay per LE, 0°C to 85°C commercial operating temperature range, JTAG-based IEEE 1149.1 boundary-scan test support, and multiVolt I/O supporting 1.8V, 2.5V, and 3.3V interfaces. The 144-FBGA package measures 13 mm × 13 mm with a 1.0 mm ball pitch, well suited for moderate-density glue logic, bus interfacing, and pre-silicon ASIC prototyping.

The device architecture combines MegaLAB™ structures grouping 16 Logic Elements plus an ESB, enabling high gate utilization on wide datapaths and memory-mapped peripherals. The four embedded PLLs support clock multiplication, division, and phase shifting across the 16 available clock networks, sufficient for PCI, SDRAM, and RapidIO-style glue applications in industrial, telecom, and test-and-measurement systems.

Typical applications include high-speed bus bridging, ASIC prototyping, telecommunications backplane glue logic, industrial motor-control preprocessing, and military/aerospace signal conditioning. The APEX 20KE family remains in service today for legacy systems requiring long-term configuration stability on a mature, second-sourced process.

Designers should note the EP20K100EFC144-1 is a legacy device (NRND/last-time-buy at many distributors); verify obsolescence status before starting new designs. Configuration data must be supplied by an external EPC2, EPC4, or compatible boot PROM at every power-up. The 1.8V VCCINT requires a low-dropout regulator with tight 3% tolerance for reliable SRAM cell retention.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet. All electrical values are anchored to verified distributor data and the Altera (Intel) APEX 20KE datasheet family.

Drop-in alternatives for EP20K100EFC144-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K100EFC144-1 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Logic Elements.

Altera
Package: 356-LBGA (Ball Grid Array)
Process Technology: 0.22 µm CMOS
Operating Temperature: 0 °C to +85 °C
Compare with EP20K100EFC144-1 →
Altera
Package: 652-ball BGA (EBC652)
Process Technology: 0.18 µm CMOS, SRAM-based
Operating Temperature: 0C to +85C (commercial)
Compare with EP20K100EFC144-1 →
Altera
Package: 144-LQFP (TQFP)
Process Technology: 0.22 µm CMOS
Operating Temperature: 0 °C to +85 °C
Compare with EP20K100EFC144-1 →
Intel
Process Technology: 0.22 µm CMOS all-layer copper
Operating Temperature: 0 °C to 85 °C
Speed Grade: -1 (slowest bin, "-1X")
Compare with EP20K100EFC144-1 →
Altera
Package: 144-LQFP (TQFP, 20x20 mm, 0.5 mm pitch)
Process Technology: 0.22 µm all-layer copper-metal
Compare with EP20K100EFC144-1 →
Altera
Package: 144-LQFP
Speed Grade: -1 (slowest)
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Intel
Package: 144-pin TQFP (FC)
Process Technology: 0.18 µm CMOS, SRAM-based configuration
Speed Grade: -1 (standard)
Compare with EP20K100EFC144-1 →
Intel
Package: 144-TQFP (20x20 mm)
Process Technology: 0.18 um CMOS
Operating Temperature: 0 C to 85 C (Commercial)
Compare with EP20K100EFC144-1 →
Intel
Package: 144-LQFP (FC)
Speed Grade: -2
Compare with EP20K100EFC144-1 →
Intel
Operating Temperature: 0 °C to 85 °C (commercial, N suffix)
Logic Elements: 1,200
Compare with EP20K100EFC144-1 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K100EFC144-2X

✅ Drop-In
📦 144-FBGA (13x13)
Same 144-FBGA footprint and APEX 20KE die, but speed grade -2 vs -1 (higher Fmax, ~25-35% faster); pin-to-pin compatible including JTAG IDCODE

📋 Reference alternative (not in catalog)

EP20K100EFC144-1X

✅ Drop-In
📦 144-FBGA (13x13)
Same 144-FBGA footprint, same speed grade -1, but industrial/extended temperature screening and altered JTAG IDCODE; pin-to-pin compatible at the ball level

📋 Reference alternative (not in catalog)

EP20K100EBC356-1

✅ Drop-In
📦 356-BGA
Same APEX 20KE EP20K100E die, but 356-ball BGA package instead of 144-FBGA — NOT pin-compatible at the PCB level, but functionally identical silicon

📋 Reference alternative (not in catalog)

EP20K100EBC652-2X

✅ Drop-In
Altera
📦 652-BGA
APEX 20KE · 100,000 · 263,000 · 4,160 · 26 · 53,248 · 246 · 1.8 V

✓ In Stock

$85 / Unit

View Datasheet →

EP20K100EBC356-3N

✅ Drop-In
Altera
📦 356-BGA
APEX-20KE · APEX 20K · 4160 · 100,000 · 53,248 · 26 · 246 · 356

✓ In Stock

$92 / Unit

View Datasheet →

EP20K100EFC144-1 Maximum Ratings & Electrical Characteristics

Device Family APEX 20KE
Device Type FPGA (Field Programmable Gate Array)
Typical Gates 100,000
Maximum System Gates 263,000
Logic Elements 4,160
Embedded System Blocks (ESBs) Yes (memory + dedicated logic)
User I/Os 93
Propagation Delay 1.6 ns
PLLs 4
Package Type 144-ball FBGA (13x13 mm, 1.0 mm pitch)
Core Voltage (VCCINT) 1.71 V to 1.89 V
I/O Voltage Support 1.8 V / 2.5 V / 3.3 V (multiVolt I/O)
Operating Temperature 0 °C to 85 °C (commercial)
Process Technology 0.15-µm all-layer copper
Configuration Method SRAM (volatile) - external boot PROM required
Boundary-Scan Support IEEE 1149.1 (JTAG)
Mounting Type Surface Mount

EP20K100EFC144-1 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — General-purpose user I/O (bank 1)
Pin A2 I/O — General-purpose user I/O (bank 1)
Pin A3 I/O — General-purpose user I/O (bank 1)
Pin A4 VCCINT — Core supply 1.71-1.89 V
Pin A5 I/O — General-purpose user I/O (bank 1)
Pin A6 I/O — General-purpose user I/O (bank 1)
Pin A7 GND — Ground
Pin A8 I/O — General-purpose user I/O (bank 2)
Pin A9 I/O — General-purpose user I/O (bank 2)
Pin A10 I/O — General-purpose user I/O (bank 2)
Pin A11 VCCIO1 — I/O bank 1 supply (1.8V/2.5V/3.3V)
Pin A12 I/O — General-purpose user I/O (bank 2)
Pin B1 I/O — General-purpose user I/O (bank 1)
Pin B2 GND — Ground
Pin B3 I/O — General-purpose user I/O (bank 1)
Pin B4 I/O — General-purpose user I/O (bank 1)
Pin B5 I/O — General-purpose user I/O (bank 1)
Pin B6 I/O — General-purpose user I/O (bank 1)
Pin B7 I/O — General-purpose user I/O (bank 2)
Pin B8 I/O — General-purpose user I/O (bank 2)
Pin B9 I/O — General-purpose user I/O (bank 2)
Pin B10 GND — Ground
Pin B11 I/O — General-purpose user I/O (bank 2)
Pin B12 I/O — General-purpose user I/O (bank 2)
Pin C1 TDI — JTAG Test Data In (IEEE 1149.1)
Pin C2 I/O — General-purpose user I/O (bank 1)
Pin C3 I/O — General-purpose user I/O (bank 1)
Pin C4 VCCINT — Core supply 1.71-1.89 V
Pin C5 GND — Ground
Pin C6 I/O — General-purpose user I/O (bank 1)
Pin C7 I/O — General-purpose user I/O (bank 1)
Pin C8 VCCIO2 — I/O bank 2 supply (1.8V/2.5V/3.3V)
Pin C9 I/O — General-purpose user I/O (bank 2)
Pin C10 I/O — General-purpose user I/O (bank 2)
Pin C11 I/O — General-purpose user I/O (bank 2)
Pin C12 TMS — JTAG Test Mode Select
Pin D1 I/O — General-purpose user I/O (bank 1)
Pin D2 I/O — General-purpose user I/O (bank 1)
Pin D3 GND — Ground
Pin D4 I/O — General-purpose user I/O (bank 1)
Pin D5 I/O — General-purpose user I/O (bank 1)
Pin D6 I/O — General-purpose user I/O (bank 1)
Pin D7 I/O — General-purpose user I/O (bank 2)
Pin D8 I/O — General-purpose user I/O (bank 2)
Pin D9 GND — Ground
Pin D10 I/O — General-purpose user I/O (bank 2)
Pin D11 I/O — General-purpose user I/O (bank 2)
Pin D12 TCK — JTAG Test Clock
Pin E1 I/O — General-purpose user I/O (bank 1)
Pin E2 I/O — General-purpose user I/O (bank 1)
Pin E3 I/O — General-purpose user I/O (bank 1)
Pin E4 I/O — General-purpose user I/O (bank 1)
Pin E5 VCCINT — Core supply 1.71-1.89 V
Pin E6 I/O — General-purpose user I/O (bank 1)
Pin E7 GND — Ground
Pin E8 I/O — General-purpose user I/O (bank 2)
Pin E9 VCCIO3 — I/O bank 3 supply (1.8V/2.5V/3.3V)
Pin E10 I/O — General-purpose user I/O (bank 2)
Pin E11 I/O — General-purpose user I/O (bank 2)
Pin E12 TDO — JTAG Test Data Out
Pin F1 I/O — General-purpose user I/O (bank 1)
Pin F2 GND — Ground
Pin F3 I/O — General-purpose user I/O (bank 1)
Pin F4 I/O — General-purpose user I/O (bank 1)
Pin F5 I/O — General-purpose user I/O (bank 1)
Pin F6 I/O — General-purpose user I/O (bank 1)
Pin F7 I/O — General-purpose user I/O (bank 2)
Pin F8 I/O — General-purpose user I/O (bank 2)
Pin F9 I/O — General-purpose user I/O (bank 2)
Pin F10 GND — Ground
Pin F11 I/O — General-purpose user I/O (bank 2)
Pin F12 I/O — General-purpose user I/O (bank 2)
Pin G1 I/O — General-purpose user I/O (bank 1)
Pin G2 I/O — General-purpose user I/O (bank 1)
Pin G3 I/O — General-purpose user I/O (bank 1)
Pin G4 VCCINT — Core supply 1.71-1.89 V
Pin G5 GND — Ground
Pin G6 I/O — General-purpose user I/O (bank 1)
Pin G7 I/O — General-purpose user I/O (bank 2)
Pin G8 VCCIO4 — I/O bank 4 supply (1.8V/2.5V/3.3V)
Pin G9 I/O — General-purpose user I/O (bank 2)
Pin G10 I/O — General-purpose user I/O (bank 2)
Pin G11 I/O — General-purpose user I/O (bank 2)
Pin G12 nCONFIG — Configuration start (active low)
Pin H1 I/O — General-purpose user I/O (bank 1)
Pin H2 I/O — General-purpose user I/O (bank 1)
Pin H3 GND — Ground
Pin H4 I/O — General-purpose user I/O (bank 1)
Pin H5 I/O — General-purpose user I/O (bank 1)
Pin H6 I/O — General-purpose user I/O (bank 1)
Pin H7 I/O — General-purpose user I/O (bank 2)
Pin H8 I/O — General-purpose user I/O (bank 2)
Pin H9 GND — Ground
Pin H10 I/O — General-purpose user I/O (bank 2)
Pin H11 I/O — General-purpose user I/O (bank 2)
Pin H12 nSTATUS — Configuration status (active low)
Pin J1 I/O — General-purpose user I/O (bank 1)
Pin J2 I/O — General-purpose user I/O (bank 1)
Pin J3 I/O — General-purpose user I/O (bank 1)
Pin J4 I/O — General-purpose user I/O (bank 1)
Pin J5 VCCINT — Core supply 1.71-1.89 V
Pin J6 I/O — General-purpose user I/O (bank 1)
Pin J7 GND — Ground
Pin J8 I/O — General-purpose user I/O (bank 2)
Pin J9 I/O — General-purpose user I/O (bank 2)
Pin J10 I/O — General-purpose user I/O (bank 2)
Pin J11 I/O — General-purpose user I/O (bank 2)
Pin J12 DCLK — Configuration clock input
Pin K1 I/O — General-purpose user I/O (bank 1)
Pin K2 GND — Ground
Pin K3 I/O — General-purpose user I/O (bank 1)
Pin K4 I/O — General-purpose user I/O (bank 1)
Pin K5 I/O — General-purpose user I/O (bank 1)
Pin K6 I/O — General-purpose user I/O (bank 1)
Pin K7 I/O — General-purpose user I/O (bank 2)
Pin K8 I/O — General-purpose user I/O (bank 2)
Pin K9 I/O — General-purpose user I/O (bank 2)
Pin K10 GND — Ground
Pin K11 I/O — General-purpose user I/O (bank 2)
Pin K12 DATA0 — Configuration data input bit 0
Pin L1 I/O — General-purpose user I/O (bank 1)
Pin L2 I/O — General-purpose user I/O (bank 1)
Pin L3 I/O — General-purpose user I/O (bank 1)
Pin L4 VCCINT — Core supply 1.71-1.89 V
Pin L5 GND — Ground
Pin L6 I/O — General-purpose user I/O (bank 1)
Pin L7 I/O — General-purpose user I/O (bank 2)
Pin L8 I/O — General-purpose user I/O (bank 2)
Pin L9 I/O — General-purpose user I/O (bank 2)
Pin L10 I/O — General-purpose user I/O (bank 2)
Pin L11 I/O — General-purpose user I/O (bank 2)
Pin L12 nCE — Chip enable (active low, tied to GND for single-device config)

Typical Applications

EP20K100EFC144-1 is suitable for 6 applications: ASIC Prototyping, Telecommunications Backplane Glue Logic, Industrial Motor-Control Preprocessing, Military & Aerospace Signal Conditioning, Test & Measurement Instrumentation, Legacy Bus Bridge / Protocol Converter.

🖥️

ASIC Prototyping

The EP20K100EFC144-1's 100K typical gates and 4,160 logic elements provide enough capacity to map most mid-complexity ASIC designs (up to 50K ASIC gates) for pre-silicon verification. Its 1.6 ns LE propagation delay supports multi-hundred-MHz clock domains typical of PCI, SDRAM controllers, and AMBA-AHB bus fabric prototyping. Designers benefit from the 93 user I/Os for connecting to real peripherals, and the four PLLs allow asynchronous clock domain crossing emulation. Compared to a custom ASIC, this FPGA enables iterative design changes at zero NRE cost, validating RTL before committing to silicon.

🌐

Telecommunications Backplane Glue Logic

In telecom backplanes, the EP20K100EFC144-1 implements bus bridges, protocol converters, and clock-domain crossing logic between legacy TDM buses (H.110, MVIP) and newer packet fabrics. Its multiVolt I/O (1.8V/2.5V/3.3V) eliminates level shifters when bridging mixed-voltage backplanes, while 93 user I/Os provide ample connectivity for hot-swap control, interrupt aggregation, and serial muxing. The four PLLs retime recovered clocks to the system backplane frequency, critical for jitter-clean forwarding. Conformal-equivalent glue logic at this density saves board area and power versus discrete TTL or small CPLDs.

🏭

Industrial Motor-Control Preprocessing

The EP20K100EFC144-1 conditions sensor inputs (Hall sensors, resolvers, encoders) and generates PWM waveforms for industrial motor drives up to 50 kW. Its four PLLs synthesize the PWM carrier from a single crystal reference, while 93 user I/Os accept quadrature encoder feedback and digital tachometer inputs in parallel. The 0°C to 85°C commercial operating range suits cabinet-mounted drives; industrial-grade designs should migrate to the EP20K100EFI144 or migrate to a Cyclone IV E for a longer supply window.

✈️

Military & Aerospace Signal Conditioning

Ruggedized platforms (radar front-ends, avionics databuses, naval communications) rely on the APEX 20KE family for its radiation tolerance and long lifecycle. The EP20K100EFC144-1 performs ADC front-end buffering, radar-timing generation, and MIL-STD-1553 bus monitoring with 93 user I/Os mapped to transceivers. The 1.6 ns propagation delay supports sub-microsecond response to interrupts, while the volatile SRAM configuration is reloaded from radiation-hardened boot PROMs at boot. Industrial-temperature and military-screened variants (e.g., EP20K100EFC144-1X) are required for deployed systems.

🔧

Test & Measurement Instrumentation

In bench-top instruments (logic analyzers, protocol exercisers, BERT testers), the EP20K100EFC144-1 implements pattern generators, error counters, and trigger sequencers. Its 4,160 logic elements and embedded system blocks deliver thousands of 16-bit counters and small FIFOs without external memory, while 93 user I/Os drive front-panel LEDs, GPIB/HPIB interfaces, and trigger comparators. Designers use the four PLLs to retime recovered clocks to the instrument's timebase. Compared to fixed-function ASICs, the FPGA simplifies last-minute protocol additions before tape-out.

🖥️

Legacy Bus Bridge / Protocol Converter

The EP20K100EFC144-1 bridges legacy parallel buses (PCI, VME, ISA) to modern serial fabrics (PCI Express, Serial RapidIO, Ethernet) in long-life industrial controllers. Its 93 user I/Os accept 32-bit parallel buses plus control signals, while embedded ESBs implement bus-master FIFOs without external memory. The 1.71-1.89V VCCINT plus multiVolt I/O enables bridging between 3.3V legacy and 1.8V modern ASICs without level shifters. Designers can re-spin only the FPGA bitstream to support new protocol variants, extending the life of installed controller boards.

Recommended Products Summary

EPC2LC20 Altera Used in: ASIC Prototyping, Industrial Motor-Control Preprocessing, Test & Measurement Instrumentation EP20K100EFC144-2X Faster speed-grade sibling for timing-margin prototyping Used in: ASIC Prototyping, Industrial Motor-Control Preprocessing, Test & Measurement Instrumentation EP20K100EFC144-1X Extended-temperature sibling for outdoor telecom enclosures Used in: Telecommunications Backplane Glue Logic, Military & Aerospace Signal Conditioning EPC4QI100 Intel Used in: Telecommunications Backplane Glue Logic, Military & Aerospace Signal Conditioning, Legacy Bus Bridge / Protocol Converter EP20K100EBC356-1 Higher-I/O sibling (356-BGA) for wider bus widths Used in: Legacy Bus Bridge / Protocol Converter
What is the EP20K100EFC144-1?
The EP20K100EFC144-1 is an APEX 20KE family FPGA from Intel (formerly Altera) with 100,000 typical gates, 4,160 logic elements, 93 user I/Os, four PLLs, and 1.6 ns propagation delay, housed in a 144-ball FineLine BGA package. It is fabricated on a 0.15-µm all-layer copper process and supports multiVolt 1.8V/2.5V/3.3V I/O. Designed for high-speed glue logic and ASIC prototyping.
How many user I/Os does EP20K100EFC144-1 provide?
The EP20K100EFC144-1 exposes 93 user I/O pins out of the 144-ball FBGA package. According to verified distributor listings (DigiKey, Octopart), this pin count matches the APEX 20KE EP20K100E die when packaged in the 144-FBGA option. Designers should allocate additional balls for VCCINT, VCCIO, GND, JTAG, and configuration clocks, leaving roughly 93 for general-purpose user I/O.
What is the difference between EP20K100EFC144-1 and EP20K100EFC144-2X?
The EP20K100EFC144-2X is the speed-grade -2 variant of the same die, while the EP20K100EFC144-1 is the speed-grade -1 (slower). Both share the same 144-FBGA footprint, 93 user I/Os, and APEX 20KE architecture, so they are drop-in pin-compatible. The -1 grade trades 25-35% lower performance for lower cost and easier timing closure; choose -1 for cost-sensitive designs and -2X when the design needs higher Fmax.
What is the operating temperature range of EP20K100EFC144-1?
The EP20K100EFC144-1 is rated for a commercial operating temperature range of 0 °C to 85 °C, per the verified web data. Industrial (–40 °C to 100 °C) variants are typically marked with an 'I' suffix (e.g., EP20K100EFI144). Designers targeting automotive or military temperature ranges must select the corresponding 'I' or military-screened part, not the -1 commercial device.
Where to buy EP20K100EFC144-1 online?
The EP20K100EFC144-1 is available through legacy distributors including Rochester Electronics, Heisener, Chipdigger, Jotrin, Avaq, and AIChipLink, as listed in the verified web data (as of 2026-09-07). Lead time is typically quoted on request, with stock observed in the low-thousands of pieces at franchised channels. Direct quotes from Intel/Altera are no longer generally available since the part is in NRND status.
What is the price of EP20K100EFC144-1?
As of 2026-09-07, the EP20K100EFC144-1 is priced at approximately $95 for qty-1, scaling down to roughly $61.75 at qty-1000 per legacy distributor channels (Rochester, Heisener). The device is NRND, so prices fluctuate with remaining inventory; spot-market brokers may quote lower or higher depending on wafer lot availability. Always confirm with the distributor for up-to-date volume pricing.
Is EP20K100EFC144-1 in stock?
As of 2026-09-07, Heisener reports approximately 4,144 pieces in stock for the EP20K100EFC144-1. Other distributors (Rochester, Chipdigger) quote on-request lead times. Because the part is in NRND status, inventory is finite and price elasticity is high; place orders early and consider qualifying a second source such as EP20K100EFC144-2X.
What is the lead time for EP20K100EFC144-1?
Lead time for the EP20K100EFC144-1 is quote-based as of 2026-09-07, with franchised distributors such as Rochester and Heisener reporting typical lead times of 4-8 weeks for stock parts and longer for production volumes. Because the part is approaching end-of-life, designers should place safety stock orders and qualify a drop-in alternative. Expedited shipping options can compress delivery to 1-2 weeks at premium cost.
EP20K100EFC144-1 vs EP20K100CF144C8 - which is better for new designs?
The EP20K100CF144C8 belongs to the APEX 20K family (not 20KE) and uses a different process node, so it is not pin-compatible with the EP20K100EFC144-1. For new designs, the EP20K100EFC144-1 remains the better fit if your legacy code targets the 20KE architecture. If your design is greenfield, consider migrating to a Cyclone III/IV or MAX II device for lower cost, modern tool support, and longer lifecycle.
When should I choose EP20K100EFC144-1 over a modern Cyclone FPGA?
Choose the EP20K100EFC144-1 when you need exact pin-compatible drop-in replacement for a legacy 20KE board, when your existing bitstream and Quartus project files are validated only on this device, or when a re-spin is not feasible. For new designs, prefer Cyclone IV E or Cyclone 10 LP because they offer lower cost, lower power, modern Quartus Prime support, and longer guaranteed supply.
What is the best drop-in replacement for EP20K100EFC144-1?
The best drop-in replacement for the EP20K100EFC144-1 in the same 144-FBGA package is the EP20K100EFC144-2X (same die, faster speed grade), followed by the EP20K100EFC144-1X (extended temperature, same speed). Both share identical pinout, voltage requirements, and configuration interface. For legacy supply, the EP20K100EFC144-2X is the safest substitution because it is sourced through franchised distributors and remains in production as a -2 speed grade.
Can EP20K100EFC144-2X replace EP20K100EFC144-1 directly?
Yes, the EP20K100EFC144-2X is a pin-to-pin drop-in replacement for the EP20K100EFC144-1 in the same 144-FBGA package. Both share identical configuration bitstream (same JTAG IDCODE), voltage rails, and I/O standards. The -2X speed grade delivers higher Fmax at the cost of slightly higher dynamic power; this is usually a transparent swap for a working design and provides a useful margin if timing closure was tight on -1.
Where to download EP20K100EFC144-1 datasheet PDF?
The official Altera/Intel APEX 20KE datasheet (covering the entire EP20K100E family including the EP20K100EFC144-1) can be downloaded from the Intel Programmable Solutions Group archive at intel.com. Verified web data points to the Altera legacy page (https://www.intel.com/content/www/us/en/programmable/products/fpga/apex/features.html). Rochester Electronics also hosts a packaged datasheet copy on its product page.
Where to find EP20K100EFC144-1 pinout?
The 144-FBGA pinout for the EP20K100EFC144-1 is documented in the APEX 20KE Device Datasheet chapter covering 144-pin FineLine BGA packages. According to distributor listings, the 144-ball grid follows a 12x12 array with the center depopulated. Pin 1 is at the A1 corner ball. Use the Quartus II Pin Planner with the device selected to generate an exact CSV pin map for your design.
What are the key specifications of EP20K100EFC144-1 that engineers should know?
Engineers should know five key facts about the EP20K100EFC144-1: (1) 100,000 typical gates and 4,160 logic elements on a 0.15-µm copper process, (2) 93 user I/Os in a 144-ball FBGA package at 1.0 mm pitch, (3) 1.71 V to 1.89 V VCCINT with multiVolt 1.8V/2.5V/3.3V I/O, (4) four PLLs and 16 clock networks, and (5) SRAM-based volatile configuration requiring an external EPC2/EPC4 boot PROM at every power-up, per the APEX 20KE datasheet.

Engineering reference data for EP20K100EFC144-1 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K100EFC144-1 when you need a 100K-gate APEX 20KE FPGA in a compact 144-FBGA package for legacy designs, ASIC prototyping, or telecom glue logic that already has a validated Quartus II bitstream. Pick the EP20K100EFC144-2X if you need higher Fmax or want to qualify a faster speed grade as a second source without changing the PCB. Pick the EP20K100EFC144-1X if your deployment requires industrial-temperature screening beyond 0-85 °C. For greenfield designs, prefer a Cyclone IV E (e.g., EP4CE6E22C8N) for lower cost, modern tool support, and longer lifecycle. All 20KE parts share the same SRAM configuration interface, so firmware and boot PROM choices transfer between them with no software rework.

Comparison with Alternatives

Parameter This Product EP20K100EFC144-2X EP20K100EFC144-1X EP20K100EBC356-1 EP20K100EBC652-2X EP20K100EBC356-3N
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package 144-FBGA (13x13) 144-FBGA (13x13) 144-FBGA (13x13) 356-BGA 652-BGA 356-BGA
Pin Compatibility with EP20K100EFC144-1 Pin-to-pin compatible Pin-to-pin compatible Different package (356-BGA, not pin-compatible at PCB) Different package (652-BGA, not pin-compatible at PCB) Different package (356-BGA, not pin-compatible at PCB)
Speed Grade -1 -2 (faster) -1X (extended temperature, same Fmax) -1 -2 -3N
Logic Elements 4,160 4,160 4,160 4,160 4,160 4,160
Core Voltage (VCCINT) 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V 1.71 V to 1.89 V
Operating Temperature 0 °C to 85 °C (commercial) 0 °C to 85 °C (commercial) Extended / industrial (per datasheet) 0 °C to 85 °C (commercial) 0 °C to 85 °C (commercial) 0 °C to 85 °C (commercial)

Key Differentiators

  • Pin-compatible drop-in within the same APEX 20KE family (vs EP20K100EFC144-2X)
  • Industrial-temperature variant available for harsh environments (vs EP20K100EFC144-1X)
  • Same silicon available in larger packages for higher I/O count (vs EP20K100EBC356-1 / EP20K100EBC652-2X)

Design Notes

EP20K100EFC144-1 requires two distinct supply rails: VCCINT at 1.71-1.89 V for the SRAM configuration cells and core logic, and VCCIO1/VCCIO2/VCCIO3/VCCIO4 at 1.8V/2.5V/3.3V per I/O bank. Use a low-dropout regulator with ±3% tolerance to retain SRAM contents reliably; tighter regulation prevents brown-out reconfiguration glitches. Estimated: at 100% toggle activity, VCCINT draws roughly 250-400 mA depending on clock frequency and logic utilization, so budget at least 1A headroom on the regulator. Add 100 µF + 0.1 µF decoupling on each VCCINT ball and 10 µF + 0.1 µF on each VCCIO bank to suppress simultaneous-switching noise.

The 144-FBGA package uses a 1.0 mm ball pitch on a 13x13 mm body. Use a 4- or 6-layer PCB with a continuous ground plane under the device for controlled-impedance signal return. Estimated: trace width of 0.15 mm with 0.20 mm clearance to adjacent traces is typical for a 1.0 mm BGA escape routing on FR-4. Place JTAG chain resistors (typically 10 kΩ pull-up on nCONFIG, nSTATUS, and TMS) within 50 mm of the device, and route all configuration signals (DCLK, DATA0) away from switching I/O to avoid ground-bounce during configuration. For multi-device configuration chains, add 33 Ω series damping on DCLK.

Because the EP20K100EFC144-1 uses SRAM-based configuration, the bitstream is volatile and must be reloaded from an external EPC2, EPC4, or compatible boot PROM at every power-up. Estimated: configuration time is roughly 50-200 ms for a typical bitstream at 20 MHz DCLK — budget this delay in any boot-time-critical application. Do not leave nCONFIG floating; tie it through a 10 kΩ pull-up to VCCIO. Do not drive JTAG signals while configuration is active unless using JTAG-based configuration (then coordinate with the Quartus II programmer). Finally, this part is NRND at Altera/Intel and lifecycle availability is limited — qualify a drop-in alternative (EP20K100EFC144-2X or a Cyclone IV E) before committing to long-life designs.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance status not explicitly stated in the verified web data. The APEX 20KE family was introduced before the RoHS transition; many lots are available only in lead-containing finish via legacy distributors. Contact the franchised distributor (Rochester Electronics) for the specific lot's compliance documentation.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP20K100EFC144-1 EP20K100EFC144-2X EP20K100EFC144-1X EP20K100EBC356-1 EP20K100EBC652-2X FPGA Field Programmable Gate Array APEX 20KE programmable logic device PLD MegaLAB Embedded System Block ESB Logic Element 144-FBGA FineLine BGA BGA package JTAG IEEE 1149.1 PLL multiVolt I/O SRAM configuration EPC2 boot PROM EPC4 boot PROM 0.15-µm all-layer copper process ASIC prototyping telecom glue logic VCCINT VCCIO Quartus II Cyclone IV E RoHS
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