EP20K400GI655-3V vs EP20K400GI655-2V Comparison
Detailed side-by-side comparison of EP20K400GI655-3V by Intel and EP20K400GI655-2V by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP20K400GI655-3V - APEX 20K 400K-Gate FPGA, 16K LE, 655-Pin PGA | Altera (Intel)
EP20K400GI655-3V ObsoleteSpecification Comparison
| Parameter | EP20K400GI655-3V | EP20K400GI655-2V |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $142.50 | $199.50 |
| Series | APEX 20K | β |
| Device Family | EP20K400 | β |
| Logic Elements | 16,640 | 16,640 |
| Typical Gate Count | 400,000 gates | β |
| Maximum User I/O | 496 | β |
| Dedicated Inputs | 6 | 6 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | β |
| Total Embedded RAM | [DATA_NEEDED: total RAM bits] | β |
| Technology | CMOS (0.18 Β΅m process) | β |
| Maximum Internal Clock Frequency | 714.2 MHz | β |
| Supply Voltage VCCINT | 2.5 V | β |
| I/O Supply Voltage VCCIO | 2.5 V or 3.3 V | β |
| Package | 655-pin SPGA (Staggered PGA), 47 x 47 mm | SPGA-655 (ceramic, 47 x 47 mm) |
| Mounting Type | Through-Hole (Pin Grid Array) | β |
| Operating Temperature | -40 Β°C to +85 Β°C (industrial) | Industrial (per -2V speed grade) |
| Moisture Sensitivity Level (MSL) | 1 | 1 |
| Qualification | Not Qualified | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Non-compliant (ceramic SPGA, contains lead) |
| Configuration Interface | IEEE 1149.1 JTAG + serial / parallel passive | β |
| Family | β | APEX 20K |
| Maximum Gates | β | 400,000 |
| Embedded RAM Bits | β | 212,992 |
| User I/O Pins | β | 496 |
| Package Equivalence Code | β | SPGA655,47X47 |
| Process Technology | β | 0.18 Β΅m CMOS |
| Core Supply Voltage | β | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | β | 3.3 V |
| Propagation Delay | β | 3.0 ns to 3.1 ns |
| Package Body Material | β | Ceramic |