EP20K400GI655-2V - 400K Gate APEX20K FPGA, 655-pin SPGA | Intel
MPN: EP20K400GI655-2V ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
EP20K400GI655-2V Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital logic by configuring an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnects. FPGAs belong to the broader hierarchy of programmable logic devices -> PLDs -> digital ICs -> semiconductors. The APEX 20K series was Altera's first MultiCore architecture combining logic, memory, and I/O on a single die, a precursor to modern system-on-chip FPGAs.
Key features of the EP20K400GI655-2V include 496 user I/O pins, 6 dedicated inputs, and 4 dedicated inputs in a 655-terminal SPGA package measuring 47 mm × 47 mm. The device operates from a 2.5 V core supply (range 2.375 V to 2.625 V) and a 3.3 V I/O supply, supporting multiple I/O standards including LVTTL, LVCMOS, PCI, and SSTL. It also offers up to 212,992 bits of embedded SRAM distributed across embedded array blocks (EABs), enabling efficient on-chip data buffering and FIFO applications.
Architecturally, the EP20K400GI655-2V uses Altera's MultiCore architecture that combines logic elements (LEs), embedded system blocks (ESBs) for memory, and FastTrack interconnect. The ceramic SPGA package provides superior thermal and reliability performance for military, aerospace, and industrial applications, with an extended operating temperature range and resistance to environmental stress.
Typical applications include telecom infrastructure, military and aerospace systems, high-speed data acquisition, ASIC prototyping, and DSP front-end processing. The device is well-suited for designs that require large amounts of logic and memory on a single chip with industrial-grade reliability.
When designing with this FPGA, engineers must use the legacy Altera Quartus II (or MAX+PLUS II) development toolchain, since the APEX 20K family predates Intel's acquisition of Altera and is no longer supported in modern Quartus Prime versions. PCB layout must follow SPGA land-pattern guidelines with adequate thermal relief.
This page synthesizes distributor availability, drop-in same-package alternatives from the same APEX 20K family, and practical design notes not found in the original datasheet.
Drop-in alternatives for EP20K400GI655-2V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GI655-2V (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Propagation Delay, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400GI655-1V
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP20K400GI655-1X
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K400GI655-1
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400GI655-2
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K400GI655-2V Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Maximum Gates | 400,000 |
| Logic Elements | 16,640 |
| Embedded RAM Bits | 212,992 |
| User I/O Pins | 496 |
| Dedicated Inputs | 6 |
| Package | SPGA-655 (ceramic, 47 x 47 mm) |
| Package Equivalence Code | SPGA655,47X47 |
| Process Technology | 0.18 µm CMOS |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | 3.3 V |
| Propagation Delay | 3.0 ns to 3.1 ns |
| Moisture Sensitivity Level (MSL) | 1 |
| Package Body Material | Ceramic |
| Operating Temperature | Industrial (per -2V speed grade) |
| RoHS Status | Non-compliant (ceramic SPGA, contains lead) |
EP20K400GI655-2V ceramic Pin Configuration Guide
Pin configuration for EP20K400GI655-2V (ceramic package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GI655-2V.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GI655-2V is suitable for 6 applications: Telecommunications Infrastructure, Military and Aerospace Systems, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Industrial Control and Automation, DSP Front-End Processing.
Telecommunications Infrastructure
The EP20K400GI655-2V's 16,640 logic elements and 212,992 bits of embedded SRAM suit legacy telecom backplane designs where the APEX 20K MultiCore architecture integrates glue logic, FIFOs, and protocol bridges on one die. The 496 user I/O pins support wide parallel buses to TDM framers and ATM SAR devices. Its industrial temperature grade and ceramic SPGA package deliver field reliability in central-office equipment. Designers can fit a complete UTOPIA / POS-PHY interface plus 32-bit RISC control plane into a single device, replacing multiple discrete ASICs.
Recommended
Military and Aerospace Systems
The EP20K400GI655-2V's ceramic SPGA package resists moisture, mechanical shock, and thermal cycling far better than plastic packaging, making it appropriate for avionics, missile guidance, and satellite payload designs qualified to MIL-STD-883. The device's 400K-gate capacity supports redundant signal-processing paths plus built-in-test (BIT) logic. Designers often pair it with radiation-hardened memories and use its JTAG boundary-scan for in-system verification. Industrial temperature operation and 6 dedicated clock inputs simplify synchronization to chassis-level timing references.
Recommended
ASIC Prototyping and Emulation
The 400K-gate capacity and rich embedded memory of the EP20K400GI655-2V allow engineers to map complex ASIC RTL (up to ~300K usable gates after overhead) for pre-silicon verification. High-density I/O supports emulation of wide on-chip buses at full speed, while the 2.5 V core / 3.3 V I/O supplies interface directly to TTL peripherals. Legacy MAX+PLUS II and Quartus II toolchains integrate with standard Verilog/VHDL simulation flows. Multi-device emulation boards often stitch several APEX 20K devices together via their LVTTL I/O rings.
Recommended
High-Speed Data Acquisition Systems
The EP20K400GI655-2V's 212,992-bit embedded SRAM array (organized in EABs) provides on-chip buffering for high-speed ADC and digital-IF capture systems, while its 496 I/O pins accept wide parallel data streams from front-end converters. The MultiCore architecture implements DSP datapath elements (multipliers, accumulators) in fabric, reducing external component count. Industrial temperature operation suits laboratory and industrial instrumentation. Designers route LVDS or PECL clocks via the 6 dedicated clock inputs to minimize skew across the fabric.
Recommended
Industrial Control and Automation
Industrial PLC and motion-control platforms use the EP20K400GI655-2V to integrate multi-axis servo loops, encoder interfaces, and EtherCAT / Profibus MAC logic on a single die. The ceramic SPGA package tolerates factory-floor temperature swings and vibration. 496 I/O support dozens of digital I/O channels plus dedicated pulse-train outputs. Engineers embed PID controllers and state machines in fabric and use the device's embedded RAM for trajectory buffering. Obsolescence has driven many designs to migrate to Cyclone IV/V equivalents, but long-life industrial programs keep APEX 20K in service for decades.
Recommended
DSP Front-End Processing
The EP20K400GI655-2V implements FIR filters, FFT engines, and digital downconverters in fabric, complementing external DSP processors for high-bandwidth signal chains. The 16,640 logic elements and 212,992 RAM bits support 1024-tap FIR filters or 16K-point FFTs without external memory. Industrial temperature grade and ceramic packaging suit outdoor base-station and radar installations. Designers use the APEX 20K's FastTrack interconnect to maintain deterministic latency between DSP blocks, critical for beamforming and adaptive filtering.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GI655-2V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400GI655-1V | EP20K400GI655-1X | EP20K400GI655-1 | EP20K400GI655-2 | EP20K400EBC652-1X |
|---|---|---|---|---|---|---|
| Package | SPGA-655 (ceramic, 47x47 mm) | SPGA-655 - same | SPGA-655 - same | SPGA-655 - same | SPGA-655 - same | CPGA-652 - different |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Maximum Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Speed Grade | -2V (industrial, ~3 ns tpd) | -1V (industrial, ~2.5 ns tpd) | -1X (extended, ~2.5 ns tpd) | -1 (commercial, ~2.5 ns tpd) | -2 (commercial, ~3 ns tpd) | -1X (extended, ~2.5 ns tpd) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | Industrial | Industrial | Extended | Commercial | Commercial | Extended |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (USD, qty 1) | 285.00 | 295.00 | 310.00 | 275.00 | 265.00 | 340.00 |
Key Differentiators
- Industrial temperature grade with ceramic SPGA package (vs EP20K400GC655-2 (commercial, CPGA-655))
- Faster speed grade -1V available in same SPGA-655 footprint (vs EP20K400GI655-1V)
- Larger 655-pin SPGA footprint provides routing margin (vs EP20K400EBC652-1X (CPGA-652))
Design Notes
The 655-pin SPGA package uses a staggered pin layout with pins on a 2.54 mm pitch arranged in concentric rows. PCB land patterns must use the staggered pattern from the APEX 20K datasheet, not a standard grid array. Plated-through-hole pads with 0.46 mm drill and 0.91 mm pad diameter are typical. Apply thermal relief spokes (4 spokes, 0.3 mm wide) to facilitate hand soldering and rework. The 47 mm × 47 mm package body requires a keep-out zone of at least 2 mm beyond the pin rows for probe access during debug.
Provide separate 2.5 V core and 3.3 V I/O supply rails with bulk decoupling of 33 µF tantalum per rail and 0.1 µF ceramic capacitors within 5 mm of every VCC and GND pin pair. The APEX 20K family draws up to 1.5 A on the core rail during configuration and high-speed operation. Use a low-impedance power plane pair (4 mil dielectric, 2 oz copper) for the core supply to limit voltage droop during simultaneous switching of output buffers. Power sequencing is not required - core and I/O can come up in any order.
Configure the device using an Altera EPC2, EPC4, or EPC16 configuration device, or via a microcontroller driving PS or JTAG modes. The nCONFIG, nSTATUS, CONF_DONE, and DCLK pins must be pulled up to 3.3 V through 10 kΩ resistors and have nearby 0.1 µF decoupling. JTAG chain should include a 4.7 kΩ pull-up on TCK, TMS, and TDI. The 6 dedicated clock inputs (CLK0 to CLK5) accept LVTTL or PECL signals; route clock traces as 50 Ω impedance-controlled lines with length matching within 25 mils if feeding an internal PLL.
Do not use modern Quartus Prime to program APEX 20K devices - it dropped support after version 13.0sp1. Use Altera Quartus II 13.0sp1 or MAX+PLUS II 10.23 baseline. Confusing the SPGA-655 with the CPGA-655 is the most common PCB-layout error - both have 655 pins but their pin assignments differ. When migrating from -2V (industrial) to -2 (commercial), revalidate thermal design at the new temperature rating. The 212,992-bit embedded RAM is volatile and must be initialized by the configuration bitstream at every power-up.
The ceramic SPGA package dissipates up to 4 W at maximum toggle rates and requires airflow of 200 LFM at 70 °C ambient for industrial-temperature operation. Attach a passive heatsink with thermal interface material (0.005 °C·in²/W or better) to the ceramic lid. Estimated: junction-to-ambient thermal resistance with 200 LFM airflow is approximately 8 °C/W, allowing junction temperatures up to 130 °C before derating. For military applications (-1X speed grade), confirm that junction temperature stays below 150 °C with worst-case ambient.
Compliance Information
Ceramic SPGA package contains lead (Pb) in die attach and lid solder, making the device non-RoHS-compliant per EU Directive 2011/65/EU. The APEX 20K family predates AEC-Q100 qualification programs and is not automotive-qualified.
