EP20K600CF672-3 vs EP20K600CF672 Comparison
Detailed side-by-side comparison of EP20K600CF672-3 by Intel and EP20K600CF672 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Specification Comparison
| Parameter | EP20K600CF672-3 | EP20K600CF672 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | [DATA_NEEDED: lifecycle status] |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.50 | $0.00 |
| Family | APEX 20KC | β |
| Typical Gates | 600,000 | β |
| Maximum System Gates | 2,432,000 | β |
| Maximum Logic Elements | 2,432 | β |
| Embedded System Memory | 311,040 bits (380 Kbits ESB) | β |
| User I/O Pins | 488 | β |
| Package | 672-ball FineLine BGA | β |
| Speed Grade | -3 | β |
| Process Technology | 0.18 Β΅m CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| PLLs | 4 | β |
| Maximum Internal Frequency | 180 MHz (per APEX 20K family datasheet) | β |
| Configuration Modes | PS, PPS, PPA, JTAG, EPC2/EPC16 | β |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL-2/3, HSTL, LVDS, PCI | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| RoHS Status | Lead-free / RoHS compliant (per Alibaba listing) | unknown |
| Product Type | β | Field-Programmable Gate Array (FPGA) |
| Product Family | β | APEX-20KC |
| Manufacturer | β | Altera / Intel |
| User I/O Lines | β | 508 I/O |
| Logic Elements | β | [DATA_NEEDED: logic element count] |
| Propagation Delay | β | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | β | SPLD |
| Performance Claim | β | Up to 35% faster than APEX 20KE devices |
| Package Type | β | 672-ball BGA, FCBGA |
| Package Dimensions | β | 45 mm x 45 mm |
| Ball Pitch | β | 1.27 mm |
| Configuration Device Type | β | Enhanced Configuration (EPC) device |
| Core Voltage | β | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | β | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | β | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | β | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | β | unknown |
| AEC-Q100 Status | β | unknown |