EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
MPN: EP20K600CF672 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP20K600CF672 Overview
A field-programmable gate array is a semiconductor device containing programmable logic resources that engineers can configure after manufacture. FPGAs occupy the broader taxonomy programmable logic device -> field-programmable gate array -> programmable logic -> digital integrated circuit -> semiconductor. Unlike a fixed ASIC, an FPGA can be reprogrammed during development, prototyping, or field updates. This flexibility reduces mask and fabrication risk and enables rapid design iteration, but usually results in higher unit cost, greater power use, and more demanding signal-integrity and power-distribution requirements.
The verified references identify 508 user I/O lines and a 672-ball BGA, FCBGA package. The search data also reports a 45 mm x 45 mm package, 1.27 mm pitch, and 488 user I/Os for speed-grade suffixes; the target-family product description reports 508 I/O lines. These values should not be conflated: suffix-level listings can reflect different catalog or package interpretations. The provided data does not establish the target's exact core voltage, logic-element count, embedded-memory capacity, configuration-interface details, operating-temperature grade, or compliance status.
The APEX 20KC family is a CMOS programmable-logic platform historically positioned for high-density designs and high-speed digital implementation. A BGA package supplies a large ball grid for power, configuration, clock, and user signals, making printed-circuit-board escape routing and simultaneous-switching-noise analysis important. The available web snippets do not provide enough verified timing, electrical, or architectural data to support additional performance claims. Engineers should use the manufacturer's complete device handbook and specific suffix documentation for final implementation limits.
Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, and legacy digital platforms. The large I/O count can help consolidate parallel buses, control interfaces, and state-machine functions into one configurable device. Existing APEX 20KC designs may use it to preserve an established board footprint while retaining programmable logic. Legacy replacement planning must verify speed grade, temperature grade, configuration method, voltage rails, and exact package-ball assignment before substitution.
For design, confirm the ordering code carefully because suffixes such as C7, C8, C9N, and I-7 can denote different grades or package details. Preserve the original ball map and supply sequencing until equivalence has been demonstrated. BGA assembly requires controlled impedance, short power paths, adequate decoupling, and thermal profiling; exact capacitor values and timing constraints must be selected from manufacturer reference documentation.
This product page separates the verified target-family facts from unavailable parameters, marks unsupported claims explicitly, and provides same-family comparison guidance without presenting non-equivalent FPGAs as drop-in replacements. Pricing shown is as of 2026-09-08 and is represented conservatively where no quote or stock value was supplied.
Drop-in alternatives for EP20K600CF672 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CF672 (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Speed Grade, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CF672C7
✅ Drop-In✓ In Stock
$2267.89 / Unit
View Datasheet →EP20K600CF672C8N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K600CF672C9N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K600CF672I-7
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K600CEF672C7
✅ Drop-In✓ In Stock
$98.4 / Unit
View Datasheet →EP20K600CB672C8N
✅ Drop-In✓ In Stock
$69 / Unit
View Datasheet →EP20K600CF672 Maximum Ratings & Electrical Characteristics
| Product Type | Field-Programmable Gate Array (FPGA) |
| Product Family | APEX-20KC |
| Manufacturer | Altera / Intel |
| User I/O Lines | 508 I/O |
| Propagation Delay | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | SPLD |
| Process Technology | 0.15 um all-layer copper-metal process for supplied family references |
| Performance Claim | Up to 35% faster than APEX 20KE devices |
| Package Type | 672-ball BGA, FCBGA |
| Package Dimensions | 45 mm x 45 mm |
| Ball Pitch | 1.27 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Configuration Device Type | Enhanced Configuration (EPC) device |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Status | unknown |
EP20K600CF672 45 mm x 45 mm Pin Configuration Guide
Pin configuration for EP20K600CF672 (45 mm x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CF672.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CF672 is suitable for 6 applications: Legacy Industrial Control Systems, Communications Infrastructure, Test and Measurement Equipment, Legacy Digital Platform Maintenance, High-Density Interface Consolidation, Signal-Processing and Control Coprocessor.
Legacy Industrial Control Systems
EP20K600CF672 can fit legacy industrial control systems that already use an APEX-20KC FPGA and require a large programmable interface. The verified target description reports 508 I/O lines, which is useful for parallel control buses, sensor aggregation, and state-machine expansion. The device should be placed where the existing board already provides the required 672-ball footprint, power rails, configuration interface, and thermal environment. Before production, verify the exact ball map and temperature suffix because the supplied references report conflicting package dimensions and I/O totals for related suffixes.
Recommended
Communications Infrastructure
EP20K600CF672 is a candidate for communications infrastructure designs that need configurable parallel interfaces, protocol adaptation, or glue-logic consolidation. Its supplied 508-I/O description and 672-ball package provide substantial connection capacity for a legacy programmable-logic platform. The FPGA can implement buffering, framing, clock-domain management, and interface conversion when its configuration and timing limits are supported by the selected design tools. A high-density BGA requires careful power distribution and signal-integrity review, especially when many outputs switch together; exact timing and I/O specifications must be obtained from the manufacturer handbook.
Recommended
Test and Measurement Equipment
EP20K600CF672 can support test and measurement equipment that requires programmable sequencing, acquisition control, or parallel data routing. The target is identified as an APEX-20KC FPGA with 508 user I/O lines, allowing multiple instrument channels and control signals to share a configurable logic fabric. This is most practical for sustaining an existing equipment design rather than creating a new high-speed platform, because the verified data does not specify current FPGA metrics such as logic capacity, embedded memory, or power consumption. Confirm the speed grade, package drawing, and configuration method before assigning precision measurement paths.
Recommended
Legacy Digital Platform Maintenance
EP20K600CF672 is most valuable in legacy digital platform maintenance, where preserving an existing APEX-20KC board may be more important than adopting a newer FPGA. The supplied data identifies a 672-ball BGA package and a 508-I/O description, allowing a maintenance design to retain the original large-footprint architecture when configuration and electrical details match. Use it for board repair, controlled spare provisioning, or incremental interface support after validating the exact suffix and ball assignment. The part should not be selected solely by family name; a speed or industrial suffix can change timing, temperature, and procurement requirements.
Recommended
High-Density Interface Consolidation
EP20K600CF672 can be used to consolidate multiple decoder, encoder, and control functions into one programmable logic device. Its 508-I/O description is significant for systems that must connect many parallel signals while retaining a configurable architecture. In a typical application, the FPGA receives synchronized digital inputs, applies state machines or protocol logic, and drives control or data outputs through the BGA interface. The benefit is design flexibility; the trade-off is BGA routing complexity, simultaneous-switching noise, and the need to verify I/O voltage and timing from the exact device documentation.
Recommended
Signal-Processing and Control Coprocessor
EP20K600CF672 may be used as a configurable coprocessor in control or signal-processing equipment where deterministic parallel processing and flexible I/O are required. The supplied family references describe a 0.15 um all-layer copper-metal process and a 1.48 ns propagation-delay figure, but those values are not target-specific enough to establish modern performance. Place the FPGA after clock and input conditioning, use the configuration interface to load the required logic, and route outputs through the board's approved BGA escape. Validate timing closure, resource utilization, power, and thermal limits with the original toolchain and handbook.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CF672 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CF672C7 | EP20K600CF672C8N | EP20K600CF672C9N | EP20K600CF672I-7 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball BGA, FCBGA | 672-ball BGA, FCBGA | 672-ball BGA, FCBGA | 672-ball BGA, FCBGA | 672-ball BGA, FCBGA |
| Product Family | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC |
| Process Technology | 0.15 um family reference | 0.15 um family reference | 0.15 um all-layer copper-metal reference | 0.15 um all-layer copper-metal reference | 0.15 um family reference |
Key Differentiators
- Large programmable I/O description for legacy high-pin-count designs (vs EP20K400CF672C7)
- Target MPN carries a broad APEX-20KC legacy-platform identity (vs EP20K600CEF672C7)
- Suitable for a 672-ball BGA, FCBGA legacy footprint (vs EP20K600CB672C8N)
Design Notes
Do not select a replacement from the APEX family name alone. The verified web results contain conflicting descriptions, including 508 versus 488 I/Os, 672-ball versus 652-pin catalog data, and 45 mm versus 27 mm package dimensions. Confirm the exact ordering code, package drawing, ball map, voltage rails, timing grade, temperature grade, and configuration interface before approving a drop-in claim.
Use the official 672-ball package drawing for escape routing and land-pattern generation. BGA fanout should provide short, symmetrical paths for clocks and high-speed differential or parallel groups, while separating power-entry, signal, and return-current regions. Follow the manufacturer reference design for plane continuity, via placement, and decoupling; exact capacitor values and counts must come from the device handbook rather than generic FPGA guidance.
The verified sources do not provide target-specific core voltage, I/O voltage, current, or power-consumption values. Do not assume standard FPGA rail levels. Obtain the exact suffix data sheet, identify all required supplies, calculate worst-case load with the intended configuration, and verify regulator transient response, sequencing, and decoupling at the BGA balls before schematic release.
Plan thermal validation from the actual configuration, clock rates, switching activity, and board airflow; those inputs were not provided. Use the manufacturer thermal model and package thermal data for the exact MPN, then verify junction and case temperatures under maximum I/O toggling. BGA reliability depends on correct reflow, underfill or inspection decisions where required, and keeping the board within the qualified temperature range.
A 672-ball programmable device can create significant simultaneous-switching noise, especially when many 508-I/O lines change together. Preserve continuous reference planes, maintain controlled impedance, shorten high-speed routes, and use the FPGA I/O guidelines in the original Altera/Intel documentation. Confirm output slew, drive strength, termination, and timing constraints for the selected speed grade; no generic substitute values are justified by the supplied web data.
Compliance Information
No verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was included in the supplied web data.
