EP20K600CF672 vs EP20K600CF672C8N Comparison
Detailed side-by-side comparison of EP20K600CF672 by Intel and EP20K600CF672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Specification Comparison
| Parameter | EP20K600CF672 | EP20K600CF672C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | [DATA_NEEDED: lifecycle status] | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $108.00 |
| Product Type | Field-Programmable Gate Array (FPGA) | FPGA / programmable logic device |
| Product Family | APEX-20KC | β |
| Manufacturer | Altera / Intel | β |
| User I/O Lines | 508 I/O | β |
| Logic Elements | [DATA_NEEDED: logic element count] | β |
| Propagation Delay | 1.48 ns for supplied EP20K600CF672C9N/C8N references | 1.48 ns |
| Device Type Listed by Supplied References | SPLD | β |
| Process Technology | 0.15 um all-layer copper-metal process for supplied family references | β |
| Performance Claim | Up to 35% faster than APEX 20KE devices | β |
| Package Type | 672-ball BGA, FCBGA | β |
| Package Dimensions | 45 mm x 45 mm | β |
| Ball Pitch | 1.27 mm | β |
| Mounting Type | Surface Mount | Surface mount |
| Operating Temperature | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references | 0Β°C to 85Β°C |
| Configuration Device Type | Enhanced Configuration (EPC) device | β |
| Core Voltage | [DATA_NEEDED: core supply voltage] | β |
| I/O Voltage | [DATA_NEEDED: I/O supply voltage] | β |
| Configuration Memory | [DATA_NEEDED: configuration memory type and capacity] | β |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | β |
| RoHS Status | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Status | unknown | β |
| Device Type | β | SPLD |
| Family | β | APEX 20KC |
| Nominal Gate Capacity | β | 600K gates |
| Logic Elements or Cells | β | 24,320 |
| Macros | β | 2,432 |
| User I/O Count | β | 508 |
| Package Terminals | β | 652 pins |
| Package | β | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | β | 672-pin FC-FBGA |
| Supply Voltage | β | 1.8 V |
| Listed Frequency | β | 301.21 MHz |
| Fabrication Process | β | 0.15 Β΅m |
| Interconnect Metal | β | All-layer copper metal |
| I/O Configuration | β | 508 user I/O |
| AEC-Q100 Qualification | β | unknown |
| Configuration Method | β | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | β | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | β | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | β | [DATA_NEEDED: maximum junction temperature] |
| Thermal Resistance | β | [DATA_NEEDED: junction-to-ambient thermal resistance] |